HOME > PUBLICATION > FOREIGN PATENT

[1] Issued (~2014) ────────────────────────────────────────

1993년

1. Neugerbauer, H. Glascock, K. W. Paik, and J. McMullen, General Electric Company, Direct thermocompression bonding for thin electronic power chips, US Patent 5,184,206 (Feb. 2, 1993)
2. Neugebauer, H.H. Glascock, K. W. Paik, and J.G. McMullen, General Electric Company, Method for forming semiconductor electrical contacts using metal foil and thermocompression bonding, US Patent 5,206,186 (April 27, 1993)

1994년

3. Neugabauer, H. Glascock, K. W. Paik, and J. McMullen General Electric Company, Direct theremocompression bonding for thin electronic power chips, US Patent 5,304,847 (April 19, 1994)
4. K. W. Paik, W. Hennessy, and W. Daum General Electric Company, Self-alignment and planarization of semiconductor chips attached by solder die adhesives to multi-chip modules, US patent 5,352,629 (Oct. 4, 1994)

1995년

5. K.W. Paik and C. Neugerbauer, Harris Corporation, Direct Bonding of Copper to Aluminum Nitride Substrates, US patent 5,418,002 (May. 23, 1995)

1997년

6. V. Krishnamurthy, K.W. Paik, M. Ghezzo, W. Kornrumpf, and E. Wildi, Fabrication of compact magnetic circulator components in microwave packages using high density interconnections , US patent 5,653,841 (Aug. 5, 1997)
7. R. Wojnarowski, J. Rose, K.W. Paik, and M. Gdula, Thin film resitors on organic substrates , US patent 5,675,310 (Oct. 7, 1997)

1998년

8. V. Krishnamurthy, K.W. Paik, M. Ghezzo, W. Kornrumpf, and E. Wildi, Fabrication of compact magnetic circulator components in microwave packages using high density interconnections , US patent 5,776,275 (July 7, 1998)
9. R. Wojnarowski, J. Rose, K.W. Paik, and M. Gdula, Method of forming thin film resistors on organic surfaces , US patent 5,849,623 (Dec. 15, 1998)

1999년

10. K. W. Paik, S. Y. Jang, Method for fabricationing chip size packages using lamination process , US patent 5,879,964 (March. 9, 1999)

2000년

11. K. W. Paik, J. S. Kim and H. S. Ko, Method of making stackable semiconductor chips to build a stacked chip module, US Patent 6,124,149 (2000)

2001년

12. K. W. Paik, J. S. Kim and H. S. Ko, Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer, US patent 6,188,129 (Feb.13,2001)
13. K. W. Paik, M. J. Yim, Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate US patent 6,238,597(2001)

2002년

14. K. W. Paik, J. W. Nah, Y. D. Jeon, M. J. Yim, Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method, US patent 6,362,090 (2002.03.26)

2003년

15. K. W. Paik, M. J. Yim, W. S. Kwon, Method for manufacturing conductive adhesive for high frequency flip chip package applications, US patent 6,514,560 (2003.02.04)
16. K. W. Paik, M. J. Yim, Method for fabricating wafer-level flip chip packages using pre-coated anisotropic conductive adhesives ,US patent 6,518,097 (2003.02.11)

2005년

17. K. W. Paik, M. J. Yim, High adhesion triple layered anisotropic conductive adhesive film, US patent 6,878,435 (Apr.12,2005)
18. K. W. Paik, M. J. Yim, Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate, 일본 특허 등록 (등록번호 제 3675285호) (2005. 05.13)
19. K. W. Paik, M. J. Yim High Reliable Non-Conductive Adhesives for Non-solder Flip Chip Bondings and Flip Chip Bonding Methods using the Same US patent 6,930,399 B2 (Aug. 16, 2005)
20. K. W. Paik, M. J. Yim High Reliability Non-Conductive Adhesives for Non-solder Flip Chip Bonding and Flip Chip Bonding Method using the Same Europe patent No. 1,314,197 (2005.11.09)
21. M. J. Yim, K. W. Paik, High Reliable Non-Conductive Adhesives for Non-solder Flip Chip Bondings and Flip Chip Bonding Methods using the Same, (AU Patent 309 615) (2005.11.15)

2006년

22. K. W. Paik, M. J. Yim High Reliability Non-Conductive Adhesives for Non-solder Flip Chip Bonding and Flip Chip Bonding Method using the Same 독일특허 DE 601 14 851 T2 (2006.08.03)

2007년

23. K. W. Paik, K. W. Jang, S. D. Cho, Polymer/Ceramic Composite Paste for Embedded Capacitor and Method for Fabricating Capacitor Using Same, (JP Patent 4035121) (2007.11.02)

2008년
24. K. W. Paik, K. W. Jang, S. D. Cho, Polymer/Ceramic Composite Paste for Embedded Capacitor and Method for Fabricating Capacitor Using Same(US Patent 7381468 B2) (2008.06.03)
25. K.W. Paik, M. J. Yim, H. Y. Son, Y. M. Kwon, Image sensor module and the fabrication therof.(US Patent 7446384) (2008.11.04)

2009년
26. K.W. Paik M.J. Yim, H.J. Kim, K.W. Lee, Method for bonding between electrical devices using ultrasonic vibraion(초음파를 이용한 전자부품간의 접속방법)(TW Patent 306423) (2009.02.21)"

2010년
27. K.W. Paik, M. J. Yim, H. Y. Son, Y. M. Kwon, Image sensor module and the fabrication therof.(이미지 센서 모듈 및 이의 제조 방법)(JP Patent 4611235) (2010.10.22)
28. 백경욱,손호영,정창규, 웨이퍼에 미리 도포된 전도성 접착제를 이용한 칩 내장 방법”(Fabrication Method of an Organic Substrate Having Embedded Active-Chips)(DE Patent 10 2008 017 569 B4) (2010.11.11)

2011년
29. K.W. Paik M.J. Yim, H.J. Kim, K.W. Lee, Method for bonding between electrical devices using ultrasonic vibraion(초음파를 이용한 전자부품간의 접속방법)( CN 101322233 B) (2011.04.20)
30. K.W. Paik, M. J. Yim, H. Y. Son, Y. M. Kwon, Image sensor module and the fabrication therof.(이미지 센서 모듈 및 이의 제조 방법)(DE Patent 10 2006 015 750 B4) (2011.02.10)

2013년
31. 백경욱, 이기원, 김승호, 초음파 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법 (Highly-reliable solder anisotropic conductive films using spacer particles)(ZL 201080040543.6 ) (2013.06.19)"

2014년
32. 백경욱, 석경림, Conductive polymer adhesive using nano-fiber(나노 파이버를 이용한 전도성 폴리머 접착제)(JP 5496343) (2014.03.14)

[2] Filed (~2014) ───────────────────────────────────────

2000년

1. K. W. Paik, M. J. Yim, Fabrication method of anisotropic conductive adhesive for flip chip on organic substrate application, 09/506,708 (2000) (USA)
2. K. W. Paik, M. J. Yim, Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate, 일본특허 출원(출원번호 2000-65022) (March 9, 2000)
3. K. W. Paik, J. S. Kim and H. S. Ko , Method of making stackable semiconductor chips to build a stacked chip module, 독일특허출원 및 일본특허등록

2001년

4. K. W. Paik, J. S. Kim and H. S. Ko, Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer, 일본, 독일, 중국 특허 출원
5. M. J. Yim, K. W. Paik, High Reliable Non-Conductive Adhesives for Non-solder Flip Chip Bondings and Flip Chip Bonding Methods using the Same, JP 2002-520292, (31, Jan, 2001)
6. K. W. Paik, J. W. Nah, Y. D. Jeon, M. J. Yim, Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method, JP2001-185572 (2001.07.06)

2002년

7. M. J. Yim, K. W. Paik, Anisotropic Conductive Film and Method of Fabricating the same for Ultra-Fine Pitch COG Application, US 10/185.002 (1, July, 2002), DE 102 30 382.7(2002.07.19), JP 2002-195566(2002.07.04)

2003년

8. M. J. Yim, K. W. Paik, High Adhesion Triple layered Anisotropic Conductive Film, JP 2002-204194 (12, July, 2003)
9. M. J. Yim, K. W. Paik, High Adhesion Triple layered Anisotropic Conductive Film, GE 102-32-991.5 (19, July, 2003)

2004년

10. K. W. Paik, K. W. Jang, S. D. Cho, Polymer/Ceramic Composite Paste for Embedded Capacitor and Method for Fabricating Capacitor Using Same, JP patent 2004-235245 (2004.08.12), US Patent 10/820.456(2004.09.18)

2006년

11. K.W. Paik, M.J. Yim, H.Y. Son, Y. M. Kwon, Image sensor module and the fabrication therof.(이미지 센서 모듈 및 이의 제조 방법), JP 2006-103801 (2006.04.05) (US 11/395.157, 2006.04.03) (DE 10 2006 015 750.8-2006.04.04) (JP 2006-103801-2006.04.05)
12. K.W. Paik, M. J. Yim, H. Y. Son, Wafer level chip size package for CMOS image sensor module and manufacturing method thereof.(이미지센서 모듈용 웨이퍼 레벨 칩 사이즈 패키지 및 이의 제조 방법) (DE 10 2006 040 623.0-2006.08.30) (US 11/513.203, 2006.08.31) (JP 2006-234379, 2006.08.30)
13. K.W. Paik M.J. Yim, H.J. Kim, K.W. Lee Method for bonding between electrical devices using ultrasonic vibraion(초음파를 이용한 전자부품간의 접속방법) (출원번호 TW 95143148) (2006.11.22)

2007년

14. K.W. Paik, H. Y. Son, Method of Manufacturing wafer-level packages for flip chips capable of preventing Adhesives from absorbing water(접착제의 수분흡습을 방지하는 플립칩용 웨이퍼 레벨 패키지 제조방법) (출원번호 JP2007-112678) (2007.04.23)
15. K.W. Paik, H. Y. Son, Method of Manufacturing wafer-level packages for flip chips capable of preventing Adhesives from absorbing water(접착제의 수분흡습을 방지하는 플립칩용 웨이퍼 레벨 패키지 제조방법) (출원번호 US 11/744,096) (2007.05.03)
16. 백경욱,손호영, 웨이퍼에 미리 도포된 전도성 접착제를 이용한 칩 내장 방법(Fabrication Method of an Organic Substrate Having Embedded Active-Chips) (출원번호 JP 2007-311469) (2007.11.30)

2008년

17. K.W. Paik M.J. Yim, H.J. Kim, K.W. Lee Method for bonding between electrical devices using ultrasonic vibraion(초음파를 이용한 전자부품간의 접속방법) (출원번호 DE 11 2006 003 181.3) (2008.05.26)
18. 백경욱,손호영, 웨이퍼에 미리 도포된 전도성 접착제를 이용한 칩 내장 방법(Fabrication Method of an Organic Substrate Having Embedded Active-Chips) (출원번호 US 12/010,894) (2008.01.30) (출원번호 DE 10 2008 017 569.2) (2008.04.07)
19. 백경욱, 장경운, 김일 Fabrication method of wafer-level flip chip packages using ACF/NCF solution coating(출원번호 JP2008-160286) (2008.06.19)
20. 백경욱, 김일, 장경운, Wafer-level ACF flip chip package using double-layerd ACF/NCF(ACF/NCF 이중층을 이용한 웨이퍼 레벨 플립칩 패키지의 제조방법)(TW 97126927) (2008.07.16)
21. 백경욱, 김일, 장경운, Wafer-level ACF flip chip package using double-layerd ACF/NCF(ACF/NCF 이중층을 이용한 웨이퍼 레벨 플립칩 패키지의 제조방법)(JP 2008-189520) (2008.07.23)

2009년
22.백경욱, 이기원, 김승호, 접착제의 발열 온도 조절을 통한 전자부품간 접속 방법 및 접착제의 발열 온도 조절을 통한 전자부품간 접속 장치(Method for bonding between electrical devices by adjusting the heating temperature of adhesive and apparatus for bonding between electrical devices by adjusting the heating temperature of adhesive)(US 12/599,928) (2009.11.12)
23. 백경욱, 이기원, 김승호, 접착제의 발열 온도 조절을 통한 전자부품간 접속 방법 및 접착제의 발열 온도 조절을 통한 전자부품간 접속 장치(Method for bonding between electrical devices by adjusting the heating temperature of adhesive and apparatus for bonding between electrical devices by adjusting the heating temperature of adhesive)(JP 91112014) (2009.11.12)
24. 백경욱, 이기원, 김승호, 접착제의 발열 온도 조절을 통한 전자부품간 접속 방법 및 접착제의 발열 온도 조절을 통한 전자부품간 접속 장치(Method for bonding between electrical devices by adjusting the heating temperature of adhesive and apparatus for bonding between electrical devices by adjusting the heating temperature of adhesive)(DE 11 2009 000 009.6) (2009.11.20)

2011년
24. "김덕훈, 백경욱, 석경림, 김재옥, Fiber, fiber aggregate and adhesive having the same(US 13/075,147) (2011.03.29)"
25. "김덕훈, 백경욱, 석경림, 김재옥, Fiber, fiber aggregate and adhesive having the same(JP 2011-072488) (2011.03.29)"
26. 김덕훈, 백경욱, 석경림, 김재옥, Fiber, fiber aggregate and adhesive having the same(CN 20111011 1458.0) (2011.04.27)

2012년
27. 백경욱,이기원,김승호, Highly-reliable solder anisotropic conductive films using spacer particles(초음파 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법)(US 13/350,264 ) (2011.11.25)
28. 백경욱,이기원,김승호, Highly-reliable solder anisotropic conductive films using spacer particles(초음파 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법)(JP 2012-520524 (PCT/KR2010/006623)) (2012.01.10)
29. 백경욱,이기원,김승호, Highly-reliable solder anisotropic conductive films using spacer particles(초음파 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법)(EPO 10799959.1) (2012.02.09)
30. 백경욱,이기원,김승호, Highly-reliable solder anisotropic conductive films using spacer particles(초음파 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법)( CN 201080040543.6) (2012.03.13)
31. 백경욱, 석경림, Conductive polymer adhesive using nano-fiber(나노 파이버를 이용한 전도성 폴리머 접착제)(JP100116872 (JP 2012-532008)) (2012.03.28)