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2016년
205. Ji-Hye Kim, Tae-Ik Lee, Taek-Soo Kim, and Kyung-Wook Paik, "Effects of ACFs adhesion on the bending reliability of Chip-in-Flex Packages for Wearable Electronics Applications" The 66th Electronic Components and Technology Conference, Las vegas, Nevada, USA 2016.0531-2016.06.03
204. Seung-Yoon Jung, Hye Eun Hong, and Kyung-Wook Paik, "A Study on the Cu-rod Anisotropic Conductive Films (ACFs) for Flex-on-Fabric (FOF) Interconnections using an Ultrasonic Bonding Method" The 66th Electronic Components and Technology Conference, Las vegas, Nevada, USA 2016.0531-2016.06.03
203. Hyeong-Gi Lee, Se-Yong Lee, Yong-Won Choi, and Kyung-Wook Paik, "Thermo-compression bonding using Non-Conductive Films (NCFs) for 3-D TSV Micro-bump interconnection" The 66th Electronic Components and Technology Conference, Las vegas, Nevada, USA 2016.0531-2016.06.03
202.SeYong Lee, Ji-Won Shin, Hyeong Gi Lee, Young Soon Kim, and Kyung-Wook Paik, "A Study on the Double Layer Non Conductive Films (NCFs) for Fine-pitch Cu-pillar/Sn-Ag Micro-Bump Interconnection", The 66th Electronic Components and Technology Conference, Las vegas, Nevada, USA 2016.0531-2016.06.03
201.Shuye Zhang, and Kyung-Wook Paik, "Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability", The 66th Electronic Components and Technology Conference, Las vegas, Nevada, USA 2016.0531-2016.06.03


2015년
200.Hyeong-Gi Lee, Yong-Won Choi, Ji-won Shin, and Kyung-Wook Paik, 'Wafer Level Packages (WLPs) Using B-stage Non-Conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-Bump Interconnection', The 65th Electronic Components and Technology Conference, San Diego, California, USA, 2015.05.26-2015.05.29
199.Ji-Hye Kim, Tae-Ik Lee, Ji-Won Shin, Taek-Soo Kim, and Kyung-Wook Paik, 'Ultra-Thin Chip-in-Flex (CIF) Technology Using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications', The 65th Electronic Components and Technology Conference, San Diego, California, USA, 2015.05.26-2015.05.29
198.Yoo-Sun Kim, Seung-Ho Kim, Jiwon Shin, and Kyung-Wook Paik, 'Reliability Improvement of Solder Anistropic COnductive Film (ACF) Joints by Controlling ACF Polymer Resin Properties', The 65th Electronic Components and Technology Conference, San Diego, California, USA, 2015.05.26-2015.05.29
197.
Sang Hoon Lee, Tae Wan Kim, and Kyung-Wook Paik, 'Plasma-Etched Nanofiber Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Interconnection', The 65th Electronic Components and Technology Conference, San Diego, California, USA, 2015.05.26-2015.05.29
196.
Ji-Won Shin, Young Soon Kim, Hyoung Gi Lee, Un Byung Kang, Sun Kyung Seo, and Kyung-Wook Paik, 'Effects of Thermo-Compression Bonding Parameters on Joint Formation of Micro-Bumps in Non-Conductive Film (NCF)', The 65th Electronic Components and Technology Conference, San Diego, California, USA, 2015.05.26-2015.05.29
195.
Seong-Yoon Jung and Kyung-Wook Paik, 'Effects of Film Viscosity on Electric Field-induced Alignment of Graphene Flakes in B-stage graphene-epoxy Composite Films', The 65th Electronic Components and Technology Conference, San Diego, California, USA, 2015.05.26-2015.05.29

2014년
194.Seong-Yoon Jung and Kyung-Wook Paik, 'Effects of Alignment of Graphene Flakes on Water Permeability of Graphene -epoxy Composite Film', The 64th Electronic Components and Technology Conference, Lake Buena Vista, Florida, USA, 2014.05.27-2014.05.30
193.Seung-Ho Kim, Yongwon Choi, Yoosun Kim and Kyung-Wook Paik, 'The Effects of Self-Fluxing Additives in Solder Anisotropic Conductive Films (ACFs) on Solder Wettability and Joint Reliability of Flex-On-Board (FOB) Assemblies', The 64th Electronic Components and Technology Conference, Lake Buena Vista, Florida, USA, 2014.05.27-2014.05.30"
192.Youngsoon Kim, Ji-won Shin, Young won Choi, Kyung-Wook Paik, 'Effects of Pad Surface Finish on Interfacial Reliabilities of Cu-Pillar/Sn-Ag Bumps of 2.5D TSV-Enterposer on PCB Applications', The 64th Electronic Components and Technology Conference, Lake Buena Vista, Florida, USA, 2014.05.27-2014.05.30
191.Ji-Won Shin, Yong-Won Choi, Young Soon Kim, Un Byung Kang, Sun Kyung Seo, and Kyung-Wook Paik, 'A Novel Double Layer NCF for Highly Reliable Micro-Bump Interconnection', The 64th Electronic Components and Technology Conference, Lake Buena Vista, Florida, USA, 2014.05.27-2014.05.30
190.Yongwon Choi, Jiwon Shin, Young Soon Kim, Kyung-lim Suk, Il Kim, and Kyung-Wook Paik* , 'A Study on the Fine Pitch Chip Interconnection Using Cu/SnAg Bumps and B-stage Non-conductive Films (NCFs) for 3D-TSV Vertical Interconnection', The 64th Electronic Components and Technology Conference, Lake Buena Vista, Florida, USA, 2014.05.27-2014.05.30
189.Ji-Won Shin, Yong-Won Choi, Young Soon Kim, Un Byung Kang, Sun Kyung Seo, and Kyung-Wook Paik, 'A Novel Fine Pitch TSV Interconnection Method Using NCF with Zn Nano -particles', The 64th Electronic Components and Technology Conference, Lake Buena Vista, Florida, USA, 2014.05.27-2014.05.30
188.Sang Hoon Lee, Tae Wan Kim, and Kyung-Wook Paik, 'A Study on Nanofiber Anisotropic Conductive Films (ACFs) for Fine Pitch Chip-on-Glass (COG) Interconnections', The 64th Electronic Components and Technology Conference, Lake Buena Vista, Florida, USA, 2014.05.27-2014.05.30
187.Yoo-Sun Kim, Seung-Ho Kim, Jiwon Shin and Kyung-Wook Paik, 'Reliability Improvement Methods of Solder Anisotropic Conductive Film (ACF) Joints Using Morphology Control of Solder ACF Joints', The 64th Electronic Components and Technology Conference, Lake Buena Vista, Florida, USA, 2014.05.27-2014.05.30
186.Tae-Wan Kim, Sang-Hoon Lee and Kyung-Wook Paik, 'Effect of Aligned Nanofiber in Nanofiber Solder Anisotropic Conductive Films (ACFs) on the Solder ball Movement for Flex-on-Flex (FOF) Assembly', The 64th Electronic Components and Technology Conference, Lake Buena Vista, Florida, USA, 2014.05.27-2014.05.30

2013년
185.Kyung-Wook Paik, Yongwon Choi, Jiwon Shin, '3D-TSV Vertical Interconnection Using Cu/SnAg Double Bumps and Non-Conductive Films (NCFs)', 2013 Pan Pacific Microelectronics Symposium, Maui, Hawaii, USA, 2013.01.22-2013.01.24
184.Kyoung-Lim Suk and Kyung-Woo Paik, 'Microsolder Ball Incorporated Nanofiber Anisotropic Conductive Adhesives (Microsolder/Nanofiber ACAs)', 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) Irvine, California, USA, 2013.02.27-2013.03.01
183.Kyoung-Lim Suk and Kyung-Wook Paik, 'Effects of Nanofiber Materials of Nanofiber Anisotropic Conductive Adhesives (Nanofiber ACAs)for Ultra-Fine Pitch Electronic Assemblies', The 63rd Electronic Components and Technology Conference, Las vegas, Nevada, USA, 2013.05.28-2013.05.31
182.Sang Hoon Lee, Kyung Lim Suk, and Kyung-Wook Paik, 'Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Solder Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method', The 63rd Electronic Components and Technology Conference, Las vegas, Nevada, USA, 2013.05.28-2013.05.31
181.Tae Wan Kim, Kyung-Lim Suk and Kyung-Wook Paik, 'Low Temperature Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Sn58Bi Solder Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method', The 63rd Electronic Components and Technology Conference, Las vegas, Nevada, USA, 2013.05.28-2013.05.31
180.Seung-Ho Kim, Yongwon Choi, Yoosun Kim and Kyung-Wook Paik, 'Flux Function added Solder Anisotropic Conductive Films (ACFs) for High Power and Fine Pitch Assemblies', The 63rd Electronic Components and Technology Conference, Las vegas, Nevada, USA, 2013.05.28-2013.05.31
179.Ji-Won Shin, Yong-Won Choi, Young Soon Kim, Un Byung Kang, Young Kun Jee, and Kyung-Wook Paik, 'Effect of NCFs with Zn-nanoparticles on the Interfacial Reactions of 40 um Pitch Cu pillar/Sn-Ag Bump for TSV Interconnection', The 63rd Electronic Components and Technology Conference, Las vegas, Nevada, USA, 2013.05.28-2013.05.31
178.Yoo-Sun Kim, Seung-Ho Kim, and Kyung-Wook Paik, 'Low Temperature Camera Module Assembly Using Acrylic-based Solder ACFs with Ultrasonic-Assisted Thermo-Compression Bonding Method', The 63rd Electronic Components and Technology Conference, Las vegas, Nevada, USA, 2013.05.28-2013.05.31

2012년
177.Kyoung-Lim Suk and Kyung-Wook Paik, 'Nanofiber Anisotropic Conductive Adhesives (Nanofiber ACAs) for next generation display electronics', 10th Nano Korea Symposium, Seoul, Korea, 2012.08.16-2012.08.18
176.Yongwon Choi, Jiwon Shin, and Kyung-Wook Paik, '3D-TSV Vertical Interconnection Method using Cu/SnAg Double Bumps and B-stage Non-Conductive Adhesives (NCAs)', The 62nd Electronic Components and Technology Conference, California, USA, 2012.05.29-2012.06.01
175.Kyoung-Lim Suk, Kyung-Wook Paik, 'Nanofiber Incorporated Anisotropic Conductive Adhesives (ACAs) for Fine Pitch Electronic Packaging Applications', Electrospin 2012, Hyatt Regency Hotel, Jeju, Korea, 2012.05.29-2012.06.01"
174.Yoo-Sun Kim, Kiwon Lee, and Kyung-Wook Paik, 'Ultrasonic-Assisted Thermo-Compression Bonding Method for High-Performance Solder Anisotropic Conductive Film (ACF) Joints', The 62nd Electronic Components and Technology Conference, California, USA, 2012.05.29-2012.06.01"
173.Il Kim, Seung-Ho Kim, Inseong You, Haeshin Lee, and Kyung-Wook Paik, 'Bio-inspired Surface Treatment on Touch Screen Panels (TSPs) for Adhesion Enhancement', The 62nd Electronic Components and Technology Conference, California, USA, 2012.05.29-2012.06.01
172.Il Kim and Kyung-Wook Paik, 'Low Temperature Curable Anisotropic Conductive Films (ACFs) with Photo-active Curing Agent (PA-ACFs)', The 62nd Electronic Components and Technology Conference, California, USA, 2012.05.29-2012.06.01"
171.Seung-Ho Kim, Young-Jae Kim, Ho Joon Park, and Kyung-Wook Paik, 'High Productivity and Damage-free Ultrasonic Anisotropic Conductive Film (ACF) Bonding for Touch Screen Panel (TSP) Assemblies', The 62nd Electronic Components and Technology Conference, California, USA, 2012.05.29-2012.06.01"
170.Hyeong-Gi Lee, and Kyung-Wook Paik, 'Vertically Aligned Nickel Nanowire/Epoxy Composite for Electrical and Thermal Conducting Material', The 62nd Electronic Components and Technology Conference, California, USA, 2012.05.29-2012.06.01
169.Ji-Won Shin, Yong-Won Choi, Young Soon Kim,Un Byung Kang, Young Kun Jee, Ji Hwan Hwang, and Kyung-Wook Paik, 'Development of Anhydride-based NCFs for Cu/Sn-Ag Eutectic Bonding and Process Optimization for Fine Pitch TSV Chip Stacking', The 62nd Electronic Components and Technology Conference, California, USA, 2012.05.29-2012.06.01"

2011년
168.Il Kim and Kyung-Wook Paik, 'Ultra low temperature curable Anisotropic Conductive Films (ACFs) with photo latent curing behavior (PLC-ACFs)', 2011 13th Electronics Packaging Technology Conference, Singapore, 2011.12.07-2011.12.09"
167.Kyoung-Lim Suk and Kyung-Wook Paik, "Novel Nanofiber Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Electronic Package Application
", Nano Korea Symposium, Kintex, Ilsan, Korea 2011.08.24~ 2011.08.26
166.Kyoung-Lim Suk and Kyung-Wook Paik, "Novel Nanofiber Anisotropic Conductive Films (ACFs) with coupled conductive particles for Ultra Fine Pitch Electronic Packaging Applications", TechConnect World presents Nanotech 2011, Boston, MA, USA 2011.06.13~ 2011.06.16
165.Yoo-Sun Kim, Kiwon Lee, Won-Chul Kim, and Kyung-Wook Paik "Effects of Bonding Parameters and ACF Material Properties on the ACF Joint Morphology in Ultrasonic Bonding" The 61th Electronic Components and Technology Conference, Florida USA 2011.05.31-2011.06.03
164.Seon Young Yu , Yong-Min Kwon , Jinsu Kim , Taesung Jeong , Seogmoon Choi , and Kyung-Wook Paik, "Study on the Thermal Cycle and Drop Test Reliability of System-in-Packages with an Embedded Die", The 61th Electronic Components and Technology Conference, Florida USA 2011.05.31-2011.06.03
163.Yong-Sung Park, Jeong-Tak Moon, Young-Woo Lee, Jae-Hong Lee, and Kyung-Wook Paik, "Effect of Fine Solder Ball Diameters on Intermetallic Growth of Sn-Ag-Cu Solder at Cu and Ni Pad Finish Interfaces During Thermal Aging", The 61th Electronic Components and Technology Conference, Florida USA 2011.05.31-2011.06.03
162.Kiwon Lee , Sangmin Oh , Ilkka J. Saarinen , Lasse Pykari , and Kyung-Wook Paik, "High-speed Flex-On-Board Assembly Method using Anisotropic Conductive Films (ACFs) Combined with Room Temperature Ultrasonic (US) Bonding for High-density Module Interconnection in Mobile Phones" The 61th Electronic Components and Technology Conference, Florida USA 2011.05.31-2011.06.03
161.Kyoung-Lim Suk, Chang-Kyu Chung and Kyung-Wook Paik, "Nanofiber Anisotropic Conductive Adhesives (ACAs) for Ultra Fine Pitch Chip-on-Film (COF) Packaging" The 61th Electronic Components and Technology Conference, Florida USA 2011.05.31-2011.06.03
160.Jonghyun Kim, Il Kim and Kyung-Wook Paik, "Investigation of Various Photo-Patternable Adhesive Materials and their Processing Conditions for MEMS Sensor Wafer Bonding" The 61th Electronic Components and Technology Conference, Florida USA 2011.05.31-2011.06.03
159. Yongwon Choi, Jiwon Shin, and Kyung-Wook Paik*, "A Study on the 3D-TSV Interconnection using Wafer-Level Non-Conductive Adhesives (NCAs), The 61th Electronic Components and Technology Conference, Florida USA 2011.05.31-2011.06.03

2010년

158. Seung-Ho Kim, Kiwon Lee, and Kyung-Wook Paik, "High Speed Touch Screen Panels (TSPs) Assembly Using Anisotropic Conductive Adhesives (ACAs) Vertical Ultrasonic Bonding Method", The 60th Electronic Components and Technology Conference, Las Vegas, U.S.A. 2010.06.01-2010.06.04
157.Yong-Sung Park and Yong-Min Kwon , Jeong-Tak Moon, Young-Woo Lee, Jae-Hong Lee, and Kyung-Wook Paik, "Effects of Fine Size Lead-Free Solder Ball on the Interfacial Reactions and Joint Reliability", The 60th Electronic Components and Technology Conference, Las Vegas, U.S.A. 2010.06.01-2010.06.04
156. Il Kim, Young Ook Cho, Jin-Baek Kim, and Kyung-Wook Paik, "Photo-Patternable Non-ConductiveAdhesives (NCAs) for Electronic Packaging Applications", The 60th Electronic Components and Technology Conference, Las Vegas, U.S.A. 2010.06.01-2010.06.04
155. Kyoung-Lim Suk, Jong-soo Kim and Kyung-Wook Paik, "Studies on Various 2-Metal Chip-on-Flex (COF) Packaging Methods", The 60th Electronic Components and Technology Conference, Las Vegas, U.S.A. 2010.06.01-2010.06.04
154. Kiwon Lee and Kyung Wook Paik, "High Power and Fine Pitch Assembly Using Solder Anisotropic Conductive Films (ACFs) Combined with Ultrasonic Bonding Technique", The 60th Electronic Components and Technology Conference, Las Vegas, U.S.A." 2010.06.01-2010.06.04
153. Ji-Won Shin, Min-Suk Song, Yong-Sung Park, Yong-Min Kwon, and Kyung-Wook Paik - KAIST, Jeong-Tak Moon, Jong-Soo Cho, and Kyung-Ah Yoo- MK Electron Co., Ltd., Kwan-Yoo Byun, Cheol-Ho Joh, and Eun-Hye Do-HYNIX Semiconductor, "Effect of Pd Addition on Ultra-fine Pitch Au Wire/Al Pad Interface", The 60th Electronic Components and Technology Conference, Las Vegas, U.S.A." 2010.06.01-2010.06.04

2009년

152. Jong Min Jang, Sanyong Lee, Kyung-Wook Paik, "Effects of BaTiO3 content and size on the viscosity and curing behavior of B-stage Epoxy/BaTiO3 composite Embedded Capacitor Films (ECFs)", The 11th International Conference on Electronic Materials and Packaging, Penang, Malaysia 2009.12.01-2009.12.03
151. Yong-Sung Park, Yong Min Kwon, Jeong-Tak Moon, Young Woo Lee, Jae-Hong Lee, Kyung-Wook Paik, "Effects of Fine Size Lead-free Solder Ball on the Interfacial Reactions and Joint Reliability", The 11th Electronics Packaging Technology Conference, Singapore 2009.12.09-2009.12.11
150. Ji-Won Shin, *Min-Suk Song, Yong-Sung Park, Yong Min Kwon, Jeong-Tak Moon, Jong-Soo Cho, Kyung-Ah Yoo, Kyung Wook Paik, "Analysis on Interfacial Failures of Ultra-fine Pitch Wire with Low Inter-metallic Coverage
", The 11th Electronics Packaging Technology Conference, Singapore
,2009.12.09-2009.12.11 942-946
149. Chang-Kyu Chung and Kyung-Wook Paik ? Korea Advanced Institute of Science & Technology (KAIST), "The Effects of the Degree of Cure of Anisotropic Conductive Films (ACFs) on the Contraction Stress Build-Up of ACFs and ACF Joints Stability for Chip-On-Flex (COF) Applications", The 59th Electronic Components and Technology Conference, San Diego, U.S.A, May. 26-29, (2009)
148. Sangyong Lee, JongMin Jang, and Kyung-Wook Paik ? Korea Advanced Institute of Science & Technology (KAIST);WoongSun Lee ? Hynix Semiconductor Incorporated, "Reliability Enhancement of Embedded Capacitors in Printed Circuit Boards Using B-stage Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs)", The 59th Electronic Components and Technology Conference, San Diego, U.S.A, May. 26-29, (2009)
147. Yongwon Choi,Kyung-Woon Jang, Chang-Kyu Chung, Sangyong Lee, and Kyung-Wook Paik ? Korea Advanced Institute of Science & Technology (KAIST), "Effects of Material Formulation on Die Attach Films (DAFs) Properties", The 59th Electronic Components and Technology Conference, San Diego, U.S.A, May. 26-29, (2009)
146. Yong-Min Kwon and Kyung-Wook Paik ? Korea Advanced Institute of Science & Technology (KAIST); Joon-Suk Kang and Young-Do Kweon ? Samsung Electro-Mechanics Company, Limited, "Bumpless Ball Grid Array (BBGA) Package Using a Solder Resist Cavity", The 59th Electronic Components and Technology Conference, San Diego, U.S.A, May. 26-29, (2009)
145. Jin-Gul Hyun,Kyung-Wook Paik, and Jun So Pak, "Characterization of Epoxy/BaTiO3 Composite Embedded Capacitors for High FrequencyBehaviors", The 59th Electronic Components and Technology Conference, San Diego, U.S.A, May. 26-29, (2009)
144. Il Kim, Ho-Young Son, and Kyung-Wook Paik - KAIST, "Patterning of Wafer Level Applied Non-Conductive Adhesives (NCAs) for Camera Image Sensor (CIS) Modules", The 59th Electronic Components and Technology Conference, San Diego, U.S.A, May. 26-29, (2009)
143. Kyoung-Lim Suk, Ho-Young Son, Chang-Kyu Chung, Kyung-Wook Paik - Korea Advanced Institute of Science & Technology (KAIST); JoongDo Kim and Jin- Woo Lee - Samsung Techwin Company, Limited, "Embedded Chip-in Flex (CIF) Packages Using Wafer Level Package (WLP) with Pre-Applied Anisotropic Conductive Films (ACFs)", The 59th Electronic Components and Technology Conference, San Diego, U.S.A, May. 26-29, (2009)

2008년

142. Ho-Young Son, Ilho Kim, Jin-Hyoung Park, Soon-Bok Lee, Gi-Jo Jung, Byung-Jin Park, and Kyung-Wook Paik, " Studies on the Thermal Cycling Reliability of Fine Pitch Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates: Experimental Results and Numerical Analysis" The 58th Electronic Components and Technology Conference, Florida, U.S.A, p.2035-2043, May 27-May 30, (2008)
141. Il Kim, Kyung-Woon Jang, Ho-Young Son, Jae-Han Kim, and Kyung-Wook Paik, " Wafer Level Packages (WLPs) using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections" The 58th Electronic Components and Technology Conference, Florida, U.S.A, p.219-224, May 27-May 30, (2008)
140. Sangyong Lee, Jin-Gul Hyun, Jun So Pak, Heejae Lee, Hyun Sin Jeon, and Kyung-Wook Paik, " Fabrication and Characterization of Embedded Capacitors in Printed Circuit Boards using B-stage Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs)" The 58th Electronic Components and Technology Conference, Florida, U.S.A, p.742-746, May 27-May 30, (2008)
139. Kyung Paik, Il Kim, Ho-Young Son, and Chang-Kyu Chung, "Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs", PAN PACIFIC Microelcronics Symposium and Tabletop Exhibition, U.S.A, Hawaii, Jan. 22-24, (2008)

2007년

138. Peng Cheng MA , Hao ZHANG , Sheng Qi WANG , Yiu Kei WONG , Ben Zhong TANG , Soon Hyung HONG, Kyung-Wook PAIK and Jang-Kyo KIM, "Electrical Conducting Behavior of Hybrid Nanocomposites Containing Carbon Nanotubes and Carbon Black" The 9th International Symposium on Electronic Materials and Packaging, Daejeon, Korea, Nov 19-22, (2007)
137. B. K. Lok , Kyung W. Paik , L. L. Wai , W. Fan , Albert C.W. Lu , Pramoda KP, "Low Temperature Processing for Integrated Magnetics" The 9th International Symposium on Electronic Materials and Packaging, Daejeon, Korea, Nov 19-22, (2007)
136. Jin-Gul Hyun, Sangyong Lee, and Kyung-Wook Paik, " Fabrication and characterization of Epoxy/BaTiO3 composite capacitor films for high frequency behaviors ", The 9th International Symposium on Electronic Materials and Packaging, KAIST(Korea Advanced Institute of Science & Technology), Daejeon, Korea, Nov. 19 - 22, (2007)
135. Yong-Sung Park, Yong-Min Kwon, Ho-Young Son, Jeong-Tak Moon, Byung-Wook Jeong, Kyung-In Kang, and Kyung-Wook Paik, " Effect of Sb Addition in Sn-Ag-Cu Solder Balls on the Drop Test Reliability of BGA Packages with Electroless Nickel Immersion Gold (ENIG) Surface Finish ", The 9th International Symposium on Electronic Materials and Packaging, KAIST(Korea Advanced Institute of Science & Technology), Daejeon, Korea, Nov. 19 - 22, (2007)
134. Kyung-Woon Jang, and Kyung-Wook Paik, " Effects of Anisotropic Conductive Film (ACF) Viscosity on ACF Fillet and Moisture-Related Reliability for Flip-Chip-On-Board (FCOB) Packages ", The 9th International Symposium on Electronic Materials and Packaging, KAIST(Korea Advanced Institute of Science & Technology), Daejeon, Korea, Nov. 19 - 22, (2007)
133. Yong-Min Kwon, and Kyung-Wook Paik, " Effect of electoless Ni/Au UBM thickness on mechanical and electromigration relibility of Pb-free solder joints ", The 9th International Symposium on Electronic Materials and Packaging, KAIST(Korea Advanced Institute of Science & Technology), Daejeon, Korea, Nov. 19 - 22, (2007)
132. Kiwon Lee, Hyoung-Joon Kim, and Kyung-Wook Paik, " Room Temperature ACF Bonding Process using Ultrasonic Vibration For Chip-On-Board and Flex-On-Board Applications ", The 9th International Symposium on Electronic Materials and Packaging, KAIST(Korea Advanced Institute of Science & Technology), Daejeon, Korea, Nov. 19 - 22, (2007)
131. Chang-Kyu Chung, Yong-Min Kwon, Il Kim, Ho-Young Son, Kyo-Sung Choo, Sung-Jin Kim, and Kyung-Wook Paik, " Theoretical Prediction and Experimental Measurement of the Degree-of-Cure of Anisotropic Conductive Film (ACF) for Chip-On-Flex (COF) applications ", The 9th International Symposium on Electronic Materials and Packaging, KAIST(Korea Advanced Institute of Science & Technology), Daejeon, Korea, Nov. 19 - 22, (2007)
130. Ho-Young Son, Il-Ho Kim, Soon-Bok Lee, Gi-Jo Jung, Byung-Jin Park, and Kyung-Wook Paik, " Thermal Cycling Reliability of Cu/SnAg Double-Bump Flip-chip Assemblies for 100um Pitch Applications ", The 9th International Symposium on Electronic Materials and Packaging, KAIST(Korea Advanced Institute of Science & Technology), Daejeon, Korea, Nov. 19 - 22, (2007)
129. Il Kim, Hyoung-Joon Kim, and Kyung-Wook Paik, " Thermal Stability at the Anisotropic Conductive Films (ACFs) / Organic Solderability Preservatives (OSPs) Interface ", The 9th International Symposium on Electronic Materials and Packaging, KAIST(Korea Advanced Institute of Science & Technology), Daejeon, Korea, Nov. 19 - 22, (2007)
128. Chang-Kyu Chung, and Kyung-Wook Paik, " Non-Conductive Films (NCFs) with Multi-Functional Epoxies and Silica Fillers for Reliable NCFs Flip Chip On Organic Boards (FCOB) ", The 57th Electronic Components and Technology Conference, Reno, Nevada, USA, pp.1831-1838, May 29 - June 1, (2007)
127. Kyung-Woon Jang, and Kyung-Wook Paik, " Effects of Heating Rate During ACFs Curing Process on Material Properties andThermal Cycling Reliability of Flip Chip Assembly ", The 57th Electronic Components and Technology Conference, Reno, Nevada, USA, pp.1725-1730, May 29 - June 1, (2007)
126. Hyoung-Joon Kim, and Kyung-Wook Paik, " Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish ", The 57th Electronic Components and Technology Conference, Reno, Nevada, USA, pp.1707-1713, May 29 - June 1, (2007)
125. Yong-Min Kwon, and Kyung-Wook Paik, " Electromigration of Pb-Free Solder Flip Chip Using Electroless Ni-P/Au UBM ", The 57th Electronic Components and Technology Conference, Reno, Nevada, USA, pp.1472-1477, May 29 - June 1, (2007)
124. Jin-Gul Hyun, and Kyung-Wook Paik, " Characteristics of Fine Patterned Epoxy/BaTiO3 Composite Embedded Capacitor Films(ECFs) for Organic Substrates ", The 57th Electronic Components and Technology Conference, Reno, Nevada, USA, pp.1027-1032, May 29 - June 1, (2007)
123. Ho-Young Son, Gi-Jo Jung, Jun-Kyu Lee, Joon-Young Choi, and Kyung-Wook Paik, " Cu/SnAg Double Bump Flip Chip Assembly as an Alternative of Solder Flip Chip on Organic Substrates for Fine Pitch Applications ", The 57th Electronic Components and Technology Conference, Reno, Nevada, USA, pp.864-871, May 29 - June 1, (2007)
122. Kiwon Lee, Hyoung Joon Kim, Il Kim, and Kyung Wook Paik, " Ultrasonic Anisotropic Conductive Films (ACFs) Bonding of Flexible Substrates on Organic Rigid Boards at Room Temperature ", The 57th Electronic Components and Technology Conference, Reno, Nevada, USA, pp.480-486, May 29 - June 1, (2007)
121. Kyung-Wook Paik, Ho-Young Son, and Chang-Kyu Chung, "Wafer level package using pre-applied anisotropic conductive films (ACFs) for flip chip assembly", Proceedings of the 12th Annual Pan Pacific Microelectronics Symposium, pp.40-47, Maui, Hawaii, USA, Jan. 30 - Fab. 1, (2007)
120. Kyung-Wook Paik, Ho-Young Son, and Chang-Kyu Chung, "Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs)", Proceedings of the 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Tokyo, Japan, pp.153-158, Jan. 16-18, (2007)

2006년

119. Chang-Kyu Chung, Hyoung-Joon Kim, and Kyung-Wook Paik, " Novel non-conductive films (NCFs) with multi-functional epoxies and silica fillers for reliable NCFs flip-chip-on-organic boards", 2006 International Symposium on Electronics Materials and Packaging, Hong-Kong, pp.26-32, December 11-14, (2006)
118. Jin-Hyoung Park, Chang-Kyu Chung, Kyung-Wook Paik, and Soon-Bok Lee, "Effect of high glass transition temperature on reliability of non-conductive film (NCF)", International conference on experimental mechanics; Experimental mechanics in nano and biotechnology, pp.517-520 (2006)
117. Myung-Jin Yim, Chang-Kyu Chung, and Kyung-Wook Paik, "Effect of conductive particle properties on the reliability of anisotropic conductive film for chip-on-glass (COG) applications", Advanced Packaging Materials, 11th International Symposium on, pp.38 (2006)
116. Kyung-Wook Paik, Jin-Gul Hyun, Sangyong Lee, Kyung-Woon Jang, "Epoxy/BaTiO3 (SrTiO3) composite films and pastes for high dielectric constant and low tolerance embedded capacitors in organic substrates", ESTC 2006 (1th Electronics System integration Technology Conference), Dresden, Germany, September 5-7, (2006)
115. Kyung-Wook Paik, "Epoxy/BaTio3 (SrTiO3) composite films and pastes for organic substrates applications", UKC 2006 (US-Korea Conference on Science, Technology, and Entrepreneurship), Teaneck, New Jersey, AUG. 10-13, (2006)
114. Kyung-woon Jang and Kyung-Wook Paik, "A study on Epoxy/BaTiO3 embedded capacitor pastes for organic substrates", The 56th Electronic Components and Technology Conference, San Diego, California, USA, pp.1504-1509, May 30 - June 2, (2006)
113. Hyoung-Joon Kim, Chang-Kyu Chung, Myung-Jin Yim, and Kyung-Wook Paik, "Study on bubble formation in rigid-flexible substrates bonding using anisotropic conductive films (ACFs) and their effects on the ACF joints reliability", The 56th Electronic Components and Technology Conference, San Diego, California, USA, pp.952-958, May 30 - June 2, (2006)
112. Ki-Won Lee, Hyoung-Joon kim, Myung-Jin Yim, and Kyung-Wook Paik, "Curing and bonding behaviors of anisotropic conductive films (ACFs) by ultrasonic vibration for flip-chip interconnection", The 56th Electronic Components and Technology Conference, San Diego, California, USA, pp.918-923, May 30 - June 2, (2006)
111. Ho-Young Son, Chang-Kyu Chung, Myung-Jin Yim, and Kyung-Wook Paik, "Wafer-level packaging using pre-applied anisotropic conductive films (ACFs) for flip-chip interconnections", The 56th Electronic Components and Technology Conference, San Diego, California, USA, pp.565-569, May 30 - June 2, (2006)
110. Myung-Jin Yim, Hyoung-Joon Kim, Chang-Kyu Chung, and Kyung-Wook Paik, "Degradation mechanism and reliability of flip-chip interconnects using anisotropic conductive adhesives for high current density packaging applications", The 56th Electronic Components and Technology Conference, San Diego, California, USA, pp.338-343, May 30 - June 2, (2006)
109. Kyung-Wook Paik, Jin-Gul Hyun, Sangyong Lee and Kyung-Woon Jang, "Epoxy/BaTiO3 (SrTiO3) composite films and pastes for high dielectric constant and low tolerance embedded capacitors in organic substrates", Pan Pacific Microelectronics Symposium & Tabletop Exhibition, Hawaii,USA, Jan. 17-19, (2006)

2005년

108. Chang-Kyu Chung, woon-Seong kwon, Jin-Hyoung Park, Soon-Book Lee, and Kyung-wook Paik, "Effects of the functional groups of non-conductive films (NCFs) on materials properties and reliability of NCF flip-chip-on-organic boards", 2005 International Symposium on Electronics Materials and Packaging, Tokyo Institute of Technology, Tokyo, Japan, pp156-161, December 11-14, (2005)
107. Ho-Young Son, Yong-woon Yeo, Gi-Jo Jung, Jun-Kyu Lee, Joon-Young Choi, Chang-Joon Park, Min-Suk Suh, Soon-Jin Cho, and Kyung-Wook Paik, "Studies on double-layered metal fumps for fine pitch flip chip applications" 2005 International Symposium on Electronics Materials and Packaging, Tokyo Institute of Technology, Tokyo, Japan, pp.95-100, December 11-14, (2005)
106. Yong-Min Kwon, Young-Doo Jeon, Kyung-Wook Paik, Jung-Do Kim, and Jin-Woo Lee, " Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints", 7th Electronic Packaging Technology Conference, Singapore, pp.287-291, December 7-9, (2005)
105. Hyoung-Joon kim, Soon-Min Hong, Se-Young Jang, Young-Joon Moon, and Kyung-Wook Paik, "Bubbles formation in rigid-flexible substrates bonding using anisotropic conductive films (ACFs) and their effects on ACFs joints reliability", 7th Electronics Packaging Technology Conference, Singapore, pp734-739, December 7-9, (2005)
104. Myung-Jin Yim, Jin-Sang Hwang, and Kyung-Wook Paik, "Anisotropic conductive film for ultra-fine pitch chip on glass (COG) applications", 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, March 16-18, (2005)
103. Woon-Seong Kwon, Se-Young Yang, Soon-Bok Lee, and Kyung-Wook Paik, "The experimental and theoretical approaches of contraction stress build-up of anisotropic conductive adhesives for flip chip interconnection", 55th Electronic Components and Technology Conference, Wyndham Palace Resort and Spa, Lake Buena Vista Florida, May 31-June 3, (2005)
102. Woon-Seong Kwon and Kyung-Wook Paik, "Conduction mechanism of anisotropic conductive adhesives (ACFs): Conductor ball deformation and build-up of contraction stresses", 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Beckman Center of the National Academies Irvine, CA, USA, March 16-18, (2005)
101. Kyung-Woon Jang, Hyoung-Joon Kim, Woon-Seong Kwon, and Kyung-Wook Paik, Internal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications, The 55th Electronic Components and Technology Conference, May 31-June3, (2005)
100. Jin-Gul Hyun, Sangyong Lee, Sung-Dong Cho, and Kyung-Wook Paik, Frequency and temperature dependence of dielectric constant of Epoxy/BaTiO3 composite embedded capacitor films (ECFs) for organic substrate, The 55th Electronic Components and Technology Conference, May 31-June3, (2005)
99. Sangyong Lee, Jin-Gul Hyun, Hyun-Jeong Park, Joung-Ho Kim, and Kyung-Wook Paik, "Frequency behavior of embedded Epoxy/SrTiO3 composite capacitor materials", The 55th Electronic Components and Technology Conference, May 31-June3, (2005)

2004년

98. Kyung-Wook Paik and Woon-Seong Kwon, "Effect of compressive stresses in anisotropic conductive films (ACFs) on contact resistance of flip chip joint", 4th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Portland, Oregon, USA 12-15 September, (2004)
97. Hyoung-Joon Kim, Kyung-Wook Paik, Sung-Gue Lee, Joon-Wook Han, Jung-Ho Hwang, Sang-Min Lee, "A study on copper-to-copper contacts in NMBITM (Neo-Manthattan Bump Interconnection Structure)", 6th International Conference on Electronic Materials and Packaging, Penang, Malaysia, Dec. 5-7, (2004)
96. Ho-Young Son, Sang-Ah Gam and Kyung-Wook Paik, "Formation of Pb/63Sn solder bumps using a solder droplet jetting method", 6th International Conference on Electronic Materials and Packaging, Penang, Malaysia, Dec. 5-7, (2004)
95. Jin-Gul Hyun, Kyung-Woon Jang, Sung-Dong Cho, Kyung-Wook Paik, Hyung-Soo Kim, and Joung-Ho Kim, "Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates", Polytronic 2004: 4th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics Portland, Oregon, USA , Sep.12-15, (2004)
94. Woon-Seong Kwon, Se-Young Yang, Soon-Bok Lee, and Kyung-Wook Paik, "The effect of Tg on Thermo-mechanical deformation and reliability of adhesive flip-chip assembles during temperature cycling", Proceedings of 54th 55th Electronic Components and Technology Conference, Caesars Palace Las Vegas, Nevada USA, June 1-4, pp. 1731-1737, (2004)
93. Kyung-Wook Paik, Young-Doo Jeon and Moon-Gi Cho, "Interfacial Reactions and Bump Reliability of Various Pb-Free Solder Bumps on Electroless Ni-P UBMs", Proceedings of 54th 55th Electronic Components and Technology Conference, Caesars Palace Las Vegas, Nevada USA, June 1-4, pp. 675-682, (2004)
92. Myung-Jin Yim, Jin-Sang Hwang, Jin-Gu Kim, Woon-Seong Kwon, Kyung-Woon Jang, and Kyung-Wook Paik, "Anisotropic conductive adhesives with enhanced thermal conductivity for flip-chip applications", Proceedings of 54th 55th Electronic Components and Technology Conference, Caesars Palace Las Vegas, Nevada USA, June 1-4, pp. 159-164, (2004)
91. Hyung-Joon Kim, Jong-Soo Cho, Yong-Jin Park, Jin Lee, and Kyung-Wook Paik, "Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability", TMS 2004 133rd Annual Meeting & Exhibition, Charlotte Convention Center, Charlotte, North Carolina, pp.339, March 14-18, (2004)
90. Jae-Woong Nah, Jong Hoon Kim, Kyung-Wook Paik, and Hyuck Mo lee, "Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure", TMS 2004 133rd Annual Meeting & Exhibition, Charlotte Convention Center, Charlotte, North Carolina, pp.294, March 14-18, (2004)
89. Sung-Dong Cho, Kyung-Woon Jang, Jin-Gul Hyun, and Kyung-Wook Paik, "Effects of BaTiO3 composite films and pastes for high dielectric constant and low tolerance embedded capacitor fabrication in organic substrates", 2004 Pan Pacific Microelectronics, kahuku, Oahu, pp. 109-115, Feb.10-12, (2004)
88. Kyung-Wook Paik, Sung-Dong Cho, Jin-Gul Hyun, "Novel Epoxy/BaTiO3 composite embedded capacitor films embedded in organic substrates", 2004 International IEEE Conference on Asian Green Electronics (AGEC), Hong-Kong, China, Jan. 5-9, (2004)

2003년

87. Woon-Seong Kwon and Kyung-Wook Paik, "Study on thermal cycling reliability and delamination of anisotropic conductives adhesives flip chip on organic substrates with emphasis on the thermal deformation", 3rd International IEEE Conference on Polymers and Adhesives In Microelectronics and Photonics, Montreux Switzerland, October 21-23, (2003)
86. Se-Young Yang, Woon-Seong Kwon, Soon-Bok Lee and Kyung-Wook Paik, "Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF", 5th International Symposium on Electronic Materials and Packaging, (2003)
85. Hyoung-Joon Kim, Woon-Seong Kwon, Kyung-Wook Paik, "Effects of electrical current on the failure mechanisms of Au stud bumps/ACF flip chip joints under high current stressing condition", 5th International Conference on Electronic Materials and Packaging, Singapore, pp. 203-208, Nov. 17-19, (2003)
84. Seong-Dong Cho, Jin-Gul Hyun, Kyung-Wook Paik, "Study on the properties of Epoxy/BaTiO3 composite embedded capacitor films for organic substrate", 5th International Conference on Electronic Materials and Packaging, Singapore, pp. 20-26, Nov.17-19, (2003)
83. Sung-Dong Cho, Jin-Gul Hyun. Kyung-Wook Paik, "Epoxy/BaTiO3 composite embedded capacitor films (ECFs) for organic substrate application", IPACK 2003, Maui, Hawaii, USA, July 06-11, (2003)
82. Se-Young Yang, Woon-Seong Kwon, Soon-Bok Lee and Kyung-Wook Paik, "Analytical Approach to Evaluate Shear Stress in Flip Chip Interconnection Using NCA/ACF", EMAP2003, (2003)
81. Woon-Seong Kwon and Kyung-Wook Paik, "Experimental analysis of compressive stresses in ACF flip chip joint and its influence on ACF joint reliability", IPACK 2003, Maui, Hawaii, USA, July 06-11, (2003)
80. Myung-Jin Yim, In-Ho Jung, K.J. Kim, H. K. Choi, Jin-Sang Hwang, Jin-Gu Kim, Jin-Yong Ahn, Woon-Seong Kwen and Kyung-Wook Paik, "Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications", 53th Electronic Components and Technology Conference, May 27~30, New Orleans, USA, pp.1398~1403, (2003)
79. Jae-Woong Nah, Kyung W. Paik, Soon-Jin Cho and Won-Hoe Kim, "Flip chip assembly on PCB substrates with coined solder bumps", Proceedings of 53rd ECTC, New Orleans, Louisiana USA, May 27-30, pp. 244-249, (2003)
78. Young-Doo Jeon, Adreas Ostmann, Herbert Reichl, and Kyung-Wook Paik, "Comparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs", Proceedings of 53rd ECTC, New Orleans, Louisiana USA, May 27-30, pp. 1203-1208, (2003)

2002년

77. Baik-Woo Lee, Jeung-Hyun Jeong, Woo-Soon Jang, Ju-Young Kim, Dong- Won Kim, Dong Il Kwon (Seoul National University, Korea) Jae-Woong Nah, and Kyung-Wook Paik (Korea Advanced Institute of Science and Technology), "Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analaysis", The 3rd International Conference On Advanced Materials Development and Performance,October 16-19, Daegu, Korea, (2002)
76. Myung-Jin Yim, Jin-Sang Hwang, Jin-Gu Kim and Jin Yong Ahn, Hyoung Joon Kim, Woon-Seung Kwon and Kyung-Wook Paik, "Highly reliable flip chip on flex package using ,multi-layered anisotropic condictive flim", Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2002, December 4-6, Taiwan, (2002)
75. Woon-Seung Kwon and Kyung-Wook Paik, Se-Young Yang and Soon-Bok Lee, "Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF", Proceedings of the 3rd International Symposium on Electronic Materials and Packaging 2002, pp. 204-209, December 4-6, Taiwan, (2002)
74. Kyung-Wook Paik, Sung-Dong Cho, Joo-Yeon Lee, and Jin-Gul Hyun, "Low tolerance Epoxy/BaTiO3 compsite embedded capacitor films(ECFs)", Proceedings of the 3rd International Symposium on Electronic Materials and Packaging 2002, pp. 341-347, December 4-6, Taiwan, (2002)
73. Suk-Jin Ham, Woong-Seong Kwon, Kyung-Wook Paik, and Soon-Bok Lee, "In-situ moire measurement of adhesive chip-chip bonded assembly under thermal cycling condition", 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, June 23 - 26, 2002 ,pp. 63-67, Hungary, (2002)
72. Myung-Jin Yim, Jin-Sang Hwang, Woon-Seong Kwon, Kyung-Woon Jang and Kyung-Wook Paik, "High reliable non-conductive adhesives for flip chip CSP applications", 2002 Electronic Components & Technology Conference (52nd ECTC), pp.1385 - 1389, San Diego, California, USA, May 28 - 31, (2002)
71. Se-Young Jang, Juergen Wolf, Heinz Gloor, and Kyung-Wook Paik, "UBM (Under Bump Metallurgy) study for Pb-free bumping : interface reaction, and electromigration", 2002 Electronic Components & Technology Conference (52nd ECTC), pp.1213-1220, San Diego, California, USA, May 28 - 31, (2002)
70. Woon-Seong Kwon and Kyung-Wook Paik, "High current induced failure of ACAs flip chip joint", 2002 Electronic Components & Technology Conference (52nd ECTC), pp.1130-1134, San Diego, California, USA, May 28 - 31, (2002)
69. Young-Doo Jeon, Sabine Nieland, Adreas Ostmann, Herbert Reichl, and Kyung-Wook Paik, "Studies on the interfacial reactions electroless Ni-P UBM and 95.5Sn-4.0Ag-0.5Cu Alloy", 2002 Electronic Components & Technology Conference (52nd ECTC), pp.740-746, San Diego, California, USA, May 28 - 31, (2002)
68. Sung-Dong Cho, Joo-Yeon Lee, and Kyung-Wook Paik, "Study on the Epoxy/BaTiO3 embedded capacitor films newly developed for PWB applications", 2002 Electronic Components & Technology Conference (52nd ECTC), pp.504-509, San Diego, California, USA, May 28 - 31, (2002)
67. Jae-Woong Nah, Woon-Hoe Kim, Ki-Rok Hur, and Kyung-Wook Paik "Characterization of coined solder bumps on PCB pads", 2002 Electronic Components & Technology Conference (52nd ECTC), pp.154-160, San Diego, California, USA, May 28 - 31, (2002)
66. Kyung-Wook Paik, Jae-Woong Nah, Woon-Hoe Kim, and Ki-Rok Hur, "Study on coined solder bumps on PCB pads", Proceedings of the 7th Pan Pacific Microelectronics Symposium, February 5-7, pp.79-85, The Westin Maui, Island of Maui, Hawaii, (2002)

2001년

65. Woon-Seong Kwon, Kyung-Woon Jang, Kyung-Wook Paik, Myung-Jin Yim, and Jin-Sang Hwang, "High reliable non-conductive adhesives for flip chip interconnections", 3rd International Symposium on Electronic Materials and Packagings 2001, November 19-22, Korea, (2001)
64. Tae-Kyung Hwang, Soon-Bok Lee, Jae-Woong Nah, and Kyung-Wook Paik, "Numerical analysis of the formation of coined solder bumps", International Symposium on Electronic Materials and Packaging 2001, pp. 388-392, Jeju Island, Korea, Nov. 19-22, (2001)
63. Woo-Soon Jang, Baik-Woo Lee, Dong-Won Kim, Jae-Woong Nah, Kyung-Wook Paik and Dong-Il Kwon, "Evaluation of thermal shear strains in flip-chip package by electronic speckle pattern interferometry (ESPI)", International Symposium on Electronic Materials and Packaging 2001, pp.310-314, Jeju Island, Korea, Nov. 19-22, (2001)
62. Se-Young Jang, Kyung-Wook Paik, Juergen Wolf, Herbert Reichl, and Heinz Gloor, "Pb-free bumping technology and UBM (Under Bump Metallurgy)", International Symposium on Electronic Materials and Packaging 2001, pp. 121-128, Jeju Island, Korea, Nov. 19-22, (2001)
61. Jae-Woong Nah, Kyung-Wook Paik, Woon-Hoe Kim, and Ki-Rok Hur, "Study on coined solder bump on micro-via PCBs", International Symposium on Electronic Materials and Packaging 2001, pp. 115-120, Jeju Island, Korea, Nov. 19-22, (2001)
60. Sung-Dong Cho, Joon-Yeon Lee, and Kyung-Wook Paik, "Effects of particle size on dielectric constant and leakage current of epoxy/barium titanate (BaTiO3) composite films for embedded capacitors", International Symposium on Electronic Materials and Packaging 2001, pp. 63-68, Jeju Island, Korea, Nov. 19-22, (2001)
59. Hyoung-Joon Kim, Joo-Yeon Lee, Kyung-Wook Paik, Kwang-Won Koh, Jin-Hee Won, Si-Hyun Choi, Jin Lee, Jung-Tak Moon, and Yong-Jin Park, "Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability", International Symposium on Electronic Materials and Packaging 2001, pp. 44-51, Jeju Island, Korea, Nov. 19-22, (2001)
58. Woon-Seong Kwon, Kyung-Woon Jang, Myung-Jin Yim, Jin-Sang Hwang, and Kyung-Wook Paik, "High reliable non-conductive adhesives for flip chip interconnections", International Symposium on Electronic Materials and Packaging 2001, pp. 34-38, Jeju Island, Korea, Nov. 19-22, (2001)
57. Myung-Jin Yim, Woon-Seong Kwon, and Kyung-Wook Paik, "Anisotropic conductive film for fine pitch COG (Chip-on-Glass) technology application", The 5th Korea-Japan International Symposium on Liquid Crystalline Materials and Devices, pp.64-65, Daegu, Korea Aug. 27-28, (2001)
56. Kyung-Wook Paik, Myung-Jin Yim, Woon-Seong Kwon, "Novel anistropic conductive adhesives flip chip on organic substrates for high frequency applications", Proceeding of 2001 Korea-Japan Joint Workshop on Advanced Semiconductor Processes and Equipments, (2001.5)
55. Kyung-Wook Paik, Young-Doo Jeon, Jae-Woong Nah, "Applications of Ni and Cu electroless plating techniques for flip chip bumping and under bump metallurgy (UBM)", InterPACK'01, July 8-13, paper number IPACK2001-15560, (2001)
54. Woon-Seong Kwon, Jun-Ho Lee, Myung-Jin Yim, Young-Doo Jeon, Jae-Woong Nah and Kyung-Wook Paik, "Microwave characterization and comparison of adhesive flip chip interconnects", IneterPACK'01, July 8-13, paper number IPACK 2001-15856, (2001)
53. Sung-Dong Cho, and Kyung-Wook Paik, "Relationships between suspension formulations and the properties of BaTiO3/epoxy composite films for integral capacitors", 2001 Electronic Components & Technology Conference (51st ECTC), pp. 1418-1422, Orlando, Florida USA, May 29 - June 1, (2001)
52. Young-Doo Jeon and Kyung-Wook Paik, "Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless nickel UBM-solder interface and their effects on flip chip solder joint reliability", 2001 Electronic Components & Technology Conference (51st ECTC), pp. 1326-1332, Orlando, Florida USA, May 29 - June 1, (2001)
51. Se-Young Jang, Juergen Wolf*, Oswin Ehrmann**, Heinz Gloor**, Herbert Reichl*, and Kyung-Wook Paik, Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder", 2001 Electronic Components & Technology Conference (51st ECTC), pp. 950-956, Orlando, Florida USA, May 29 - June 1, (2001)
50. Jae-Woong Nah and Kyung-Wook Paik, "Investigation of low cost flip chip under bump metallization (UBM) systems on Cu pads", 2001 Electronic Components & Technology Conference (51st ECTC), pp. 790-795, Orlando, Florida USA, May 29 - June 1, (2001)
49. Kyung-Wook Paik, "Anisotropic conductive adhesives flip chip technology", Asymtek & Tsinghua University Workshop, May 15-16, Shanghai, (2001)
48. Kyung-Wook Paik, Myung-Jin Yim, and Woon-Seong Kwon, "Reliable anisotropic conductive adhesives flip chip technology on organic substrates for high frequency applications", The 6th International Symposium on Microelectronics and Packaging, April 25, KIST, Korea, (2001)
47. Se-Young Jang, Jurgen Wolf*, Oswin Ehrmann**, Heinz Gloor**, Herbert Reichl*, and Kyung-Wook Paik, "Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder sumps", MicroSystem Technologies, pp.131-136, Duesseldorf, Gemany, March 27-29, (2001)
46. Kyung-Wook Paik, Myung-Jin Yim, and Woon-Seong Kwon, "Significant reliablity enhancement using new anisotropic conductive adhesives for flip chip on organic substrates applications", 2001 Pan Pacific Microelectronics Symposium, pp. 217-223, Hawaii, February 13-16, (2001)

2000년

45. Ji-Hyuk Lim, Jin-Su Kim, and Yoon-Yong Earmme, "Thermomechanical stress analysis of multilayer PCBs consisting of metals and viscoelastic polymers", International Conference on Fracture & Strength of Solids, Pohang, Korea, (2000)
44. Kyung-Wook Paik, Myung-Jin Yim, and Young-Doo Jeon, "Flip chip assembly on organic boards uUsing anisotropic conductive adhesives (ACAs) and nickel/gold bumps", 2000 Electronics Packaging Technology Conference(3rd EPTC), pp. 378-384, Singapore, December 5-7, (2000)
43. Kyung-Wook Paik , and Myung-Jin Yim, "New anisotropic conductive adhesives for low cost and reliable flip chip on organic substrates applications", 2000 Int’l Symp on Electronic Materials & Packaging (EMAP2000), pp. 282-288, Hong- Kong, November 30 - December 2, (2000)
42. Se-Young Jang, and Kyung-Wook Paik, "Comparison of electroplated eutectic Sn/Bi and Pb/Sn solder bumps on various UBM system", Proceedings of the 50th Electronic Components and Technology Conference, pp. 64-68, May 21- 24, (2000)
41. Myung-Jin Yim, and Kyung-Wook Paik, "Effect of non-conducting filler additions on anisotropic conductive adhesives properties and the reliability of ACAs flip-chip on organic substrates", Proceedings of the Electronic Components and Technology Conference, pp. 899-905, May 21- 24, (2000)

1999년

40. Seung-Young Ahn, Woong-Hwan Ryu, Myung-Jin Yim, Jun-Ho Lee, Young-Doo Jeon, Woo-Poung Kim, Kyung-Wook Paik, Joung-Ho Kim, "Comparison of Ni-filled Balls and Au-coated Polymer Balls in High-frequency Application of ACF flip-chip Joint", APACK'99 Symposium on Advances in Packaging, pp.353-356, Dec. 8 -10, Singapore, (1999)
39. Seung-Young Ahn, Woong-Hwan Ryu, Myung-Jin Yim, Jun-Ho Lee, Young-Doo Jeon, Woo-Poung Kim, Kyung-Wook Paik, Joung-Ho Kim, "Over 10 GHz Equivalent Circuit Model of ACF Flip-Chip Interconnect using Ni-filled Ball and Au-coated Polymer Balls", IEEE/CPMT Int. Electronics Manufacturing Technology Symposium, pp. 421-425, Oct. 18 -19, Austin, TX, U.S.A. (1999)
38. Myung-Jin Yim, Young-Doo Jeon, Jae-Woong Nah, Woon-Seong Kwon and Kyung-Wook Paik, "Flip-Chip-on-Glass (FCOG) technology using electroless Ni/Cu/Au bump and ACF for LCD packaging", Sep.17-18, Liquid Crystal Materials and Device '99, pp. 199-204, (1999)
37. Woong-Hwan Ryu, Myung-Jin Yim, Jun-Ho Lee, Young-Doo Jeon, Seoung-Young Ahn, Y. H. Yun, S. H. Ham, Y. H. Lee, Kyung-Wook Paik and Joung-Ho Kim, "Microwave frequency model of flip-chip interconnections using anisotropic conductive film", International Conference on High Density Packaging and MCMs, pp. 311-315, April. 5-8, Denver, U.S.A. (1999)
36. Myung-Jin Yim, Young-Doo Jeon, and Kyung-Wook Paik, "Electroless Ni bumped flip chip interconnection on an organic substrate using anisotropic conductive adhesives/films (ACAs/ACFs)", International Advanced Technology Workshop on Flip Chip Technology, March. 12-14, Braselton, U.S.A. (1999)
35. Myung-Jin Yim, Young-Doo Jeon, and Kyung-Wook Paik, "Flip chip assembly on board using anisotropic conductive adhesive/film and nickel-gold bump", Advances in Electronic Packaging, pp. 367-372, Jun. 13-19, Hawaii, U.S.A. (1999)
34. Myung-Jin Yim, Woong-Hwan Ryu, Young-Doo Jeon, J. H. Kim, Joung-Ho Kim, and Kyung-Wook Paik, "Microwave model of anisotropic conductive adhesive flip-chip interconnections for high frequency applications", Proceedings of the 49th Electronic Components and Technology Conference, pp. 488-492, Jun 1-4, San Diego, U.S.A. (1999)
33. Kyung-Wook Paik and Myung-Jin Yim, "Understanding of anisotropic conductive films(ACFs)/adhesives(ACAs) for packaging applications", 128th TMS annual meeting, Feb.28 - Mar.4, San Diego, U.S.A. (1999. 2)
32. Hyoung-Soo Ko, Jin-Su Kim, Hyun-Gook Yoon, Se-Young Jang, Sung-Dong Cho, and Kyung-Wook Paik, "Development of 3-dimensional memory die stack packages using polymer insulated sidewall technique", Proceedings of the 49th Electronic Components and Technology Conference, San Diego, CA, June 1-4, (1999)
31. Se-Young Jang and Kyung-Wook Paik, "Study on the under bump metallutgy (UBM) for electro-plated eutectic Pb/Sn soder bumps on organic substrates", Pan Pacific Microelectronics Symposium, Hawaii, pp. 173-179, (1999. 2)

1998년

30. Se-Young Jang, Kyung-Wook Paik, "The study on the under bump metallurgy (UBM) and 63Sn-37Pb solder bumps interface for flip chip interconnection", Proceeding Materials Research Society (MRS) Symposium Spring Meeting, p.190, San Francisco, California, pp. 67-72, (1998)
29. Se-Young Jang and Kyung-Wook Paik, "Interfacial studies on the electroplated eutectic Pb/Sn flip-chip solder bump and UBM (Under Bump Metallurgy)", International Conference on Electronic Materials, Cheju, Korea, (1998)
28. Se-Young Jang and Kyung-Wook Paik, "Eutectic Pb/Sn solder bump and under bump metallurgy (UBM) interfacial reaction and adhesion", 2nd electronic Packaging Technology Conference, Singapore, (1998)
27. Jin-Su Kim, Kyung-Wook Paik, Seung-Hwan Oh, and Hyun-Sik Seo, "Thermo-bechanical stresses in lamination based Si monolithic MCM-D substrates", Materials Research Society Spring Meeting, p.192, San Francisco, California, (1998)
26. Jin-Su Kim, Kyung-Wook Paik, Seung-Hwan Oh, and Hyun-Sik Seo, "Thermo-mechanical stresses in laminated polymer films on silicon substrates", International Conference and Exhibition on Multichip Modules and High Density Packaging, pp.449-453, Denver, Colorado, (1998. 4)
25. Jin-Su Kim, Hyoung-Soo Ko, Hyun-Gook Yoon, Sung-Dong Cho, and Kyung-Wook Paik, "Low-cost & high-reliability MCM-D substrate unit process development", International Conference on Electronic Materials, p.96, Cheju, Korea, (1998)
24. Myung-Jin Yim and Kyung-Wook Paik, "Anisotropic conductive films with area-arrayed conducting microbumps", International Conference on Electronic Materials, p.139, Cheju, Korea, (1998)
23. Myung-Jin Yim and Kyung-Wook Paik, T.S. Kim and Y. K. Kim, "Anisotropic conductive films(ACFs) interconnection for display packaging applications", Proceedings of the 48th Electronic Components and Technology Conference, pp. 1036-1041, May 25-28, (1998)
22. Kyung-Wook Paik and K. S. Hwang, and D. H. Lee, "The effect of alumina powder filled polyimide adhesive on the thermo-mechanical stress of lead-on-chip package", 3rd Pan Pacific Microelectronics Symposium, Hawaii, Serial 3, pp. 429-434, (1998. 2)
21. Hyoung-Soo Ko, Jin-Su Kim, Hyun-Gook Yoon, Se-Young Jang, Sung-Dong Cho, and Kyung-Wook Paik, "Novel 3-dimensional memory stack package using polymer insulated sidewall", International Conference on Electronic Materials, p.97, Cheju, Korea, (1998)

1997년

20. Soon-Jin Cho and Kyung-Wook Paik, "The effect of Cu-base leadframe oxidation on the Cu/EMC adhesion", 2nd Pan Pacific Microelectronics Symposium, Hawaii, Vol.2, pp.233-239, (1997)
19. Soon-Jin Cho and Kyung-Wook Paik, "Low temperature oxidation of Cu-base leadframe and Cu/EMC interface adhesion", MRS 96 Fall meeting, Proceedings of Materials Research Society Symposium, Vol. 445, pp.275-280, (1997)
18. Myung-Jin Yim and Kyung-Wook Paik, "Design and understanding of anisotropic conductive films (ACFs) for LCD packaging", PEP'97, pp. 233-242, Oct. 27-31, (1997)
17. Myung-Jin Yim and Kyung-Wook Paik, "A study on the electrical conduction mechanism of anisotropically conductive Film (ACF) for LCD packaging applications", InterPACK'97, pp. 65-72, Jun. 24-28, (1997)

1996년

16. Ki-Hwan. Kim, Don-Bae Lee, Chang-Kyu Kim, I. Gook, and Kyung-Wook Paik, "Development of uranium-silicide and U-Mo alloy fuels by centruifugal atomization", Technical Committee on Research of Fuel Aimed by Low Fission Gas Release, Russia, (1996,10)
15. Soon-Jin Cho and Kyung-Wook Paik, "The effect of Cu leadframe oxidation on Cu/EMC adhesion", The 3rd VLSI Packaging Workshop of Japan, pp.57-58, Dec. 2-4, (1996)

1995년

14. Kyung-Wook Paik, "Studies on thin film integral passive components for mixed mode multichip module (MCM) applications", Proceeding of 1995 Japan International Electronic Manufacturing Technology Symposium Proceeding, pp.365-368, December 4-6, (1995)
13. Kyung-Wook Paik and T. Lu, "Thin film integral capacitor fabricated on a polymer dielectric for HDI applications" , Proceedings of Materials Research Society Symposium, Vol. 390, pp. 33-38, (1995)

1994년

12. Kyung-Wook Paik and E. Bernard, "Reliability studies on GE high density interconnect (HDI) modules", Proceedings of Materials Research Society Symposium, Vol. 323, pp. 71 - 76, (1994)
11. Kyung-Wook Paik, A. Mogro-Campero and L.Turner, "Studies on the high temperature superconductor (HTS)/metal/polymer dielectric interconnect structure for packaging applications", 44th ECTC Proceeding, pp.362-336, (1994)

1993년

10. Li, X. Wu, M. Pecht, Kyung-Wook Paik, and E. Bernard, "Effects of humidity cycling on polymer overlaid high density interconnects", Proceeding of IEEE-CHMT VLSI Packaging Workshop, Oct. pp. 11-13, (1993)

1992년

9. V. Krishnamurthy, Kyung-Wook Paik, and D. Lester, "Characterization of polyimide die-attach adhesives on Au and Al surfaces", Proceedings of the 1992 international symposium on hybrid microelectronics (ISHM) conference, pp. 719 -724, (1992)
8. Kyung-Wook Paik, H.S. Cole, and N.H. Hendricks, "Studies of PQ-100(TM) polyquinoline film for multichip module(MCM) applications", Proceedings of Materials Research Society Symposium, Vol. 264, pp. 161-166, (1992)
7. Kyung-Wook Paik, "Evaluation of aluminum nitride (AlN) substrate material for high density interconnect (HDI) applications", Proceedings of the 1992 ISHM conference, pp.555-560, (1992)

1991년

6. Kyung-Wook Paik, R.J. Saia and J.J. Chera, "Studies on the surface morphology of BCB films by plasma ions", Proceedings of Materials Research Society Symposium, Vol. 203, pp.303-308, (1991)
5. Kyung-Wook Paik and H.S. Cole, "Interfacial studies on Cr and Ti deposited on BCB film", Proceedings of Materials Research Society Symposium, Vol. 203, pp.309-314, (1991)

1989년

4. Kyung-Wook Paik and A.L. Ruoff, "Surface morphological changes of PI with oxygen reactive ion beam etching (RIBE)", Proceedings of Materials Research Society Symposium, Vol. 129, pp.495-500, (1989)
3. Kyung-Wook Paik and A.L. Ruoff, "RBS studies on Ti, Ni and Zr diffusion in polyimide", Proceedings of Materials Research Society Symposium, Vol. 153, pp.143-148, (1989)
2. Kyung-Wook Paik and A.L. Ruoff, "Development of new ion beam modification techniques to enhance copper and polyimide adhesion in multilevel electronic packaging", Proceedings of Materials Research Society Symposium, Vol. 154, pp.21-26, (1989)

1988년

1. Kyung-Wook Paik and A.L. Ruoff, "Oxygen reactive ion beam etching on polyimide to enhance copper film adhesion", Proceedings of Materials Research Society Symposium, Vol. 119, pp.271-276, (1988)