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2017년
142. Youngsoon Kim, Taeshik Yoon, Tae-Wan Kim, Taek-Soo Kim, and Kyung-Wook Paik, Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 7, no.3, pp.371-378, Mar. 2017
141. Hyeong Gi, Ji-Won Shin, Yong-Won Choi, and Kyung-Wook Paik, Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 7, no.3, pp.450-455, Mar. 2017
140. Sang-Hoon Lee and Kyung-Wook Paik, A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications, JOURNAL OF ELECTRONIC MATERIALS, vol. 46, no.1, pp.167-174, Jan. 2017

2016년
139. Shuye Zhang, Jae-Hyeong Park, and Kyung-Wook Paik, Joint Morphologies and Failure Mechanisms of Anisotropic Conductive Films (ACFs) During a Power Handling Capability Test for Flex-On-Board Applications, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 6, no.12, pp.1820-1826, Dec. 2016
138. Tae-Wan Kim, Tae-Ik Lee, Yan Pan, Wansun Kim, Shuye Zhang, Taek-Soo Kim, and Kyung-Wook Paik, Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 6, no.9, pp.1317-1329, Sep. 2016
137. Jae-Hyeong Park, Tae-Wan Kim, Shuye Zhang, and Kyung-Wook Paik, Effects of Polymer Ball Size and Polyvinylidene Fluoride Nanofiber on the Ball Capture Rate for 100um-Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 6, no.7, pp.1129-1136, Jul. 2016
136. Youngsoon Kim, Seyong Lee, Ji-Won Shin, and Kyung-Wook Paik, Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly, JOURNAL OF ELECTRONIC MATERIALS, vol. 45, no.6, pp.3208-3219, Jun. 2016
135. Shuye Zhang and Kyung-Wook Paik, A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling, IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, vol.6, no.2, pp.216-223, Feb. 2015
134.
Ji-Hye Kim, Tae-Ik Lee, Ji-Won Shin, Taek-Soo Kim, and Kyung-Wook Paik, Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronic Applications, IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, vol.6, no.2, pp.208-215, Feb. 2015
133.Young-Lyong Kim, Tae-Ik Lee, Ji-Hye Kim, Wonsik Kim, Taek-Soo Kim, and Kyung-Wook Paik, Effects of the Mechanical Properties of Polymer Resin and Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package, IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, vol.6, no.2, pp.200-207, Feb. 2015

2015년
132.Hyeong-Gi Lee, Yong-Won Choi, Ji-Won Shin, and Kyung-Wook Paik, Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn-Ag Microbump Interconnection, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 5, No.11, pp. 1567~1572, Nov. 2015
131.Sang-Hoon Lee, Tae-Wan Kim, Kyung-Lim Suk, and Kyung-Wook Paik, Nanofiber Anisotropic Conductive Films (ACF) for Ultra-Fine-Pitch Chip-on-Glass (COG) Interconnections, JOURNAL OF ELECTRONIC MATERIALS, vol. 44, No.11, pp. 4628~4636, Nov. 2015
131.
Yoo-Sun Kim, Seung-Ho Kim, Ji-Won Shin, and Kyung-Wook Paik, Effects of Bonding Pressures and Bonding Temperatures on Solder Joint Morphology and Reliability of Solder ACF Bonding, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 5, No.9, pp. 1350~1357, Sep. 2015
129.
Hyeong-Gi Lee and Kyung-Wook Paik, Effects of Curing Agent and Curing Temperature on Material Properties of Epoxy/BaTiO3 Composite Embedded Capacitor Films, IEEE Transactions on Components Packaging and Manufacturing Technology, vol. 5, No.4, pp. 451~459, Apr. 2015
128.
Ji-Won Shin, Il Kim, Yong-Won Choi, Young Soon Kim, Un Byung Kang, Young Kun Jee, and Kyung-Wook Paik, Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 um pitch Cu-pillar/Sn-Ag bump interconnection, MICROELECTRONICS RELIABILITY, vol. 55, No.2, pp. 432~441, Feb. 2015
127.
Seung-Ho Kim, Yongwon Choi, Yoo-Sun Kim, and Kyung-Wook Paik, Effect of Flux Activators on the Solder Wettability of Solder Anisotropic Conductive Films, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 5, No.1, pp. 3~8, Jan. 2015
126.
Shuye Zhang, Seung-Ho Kim, Tae-Wan Kim, Yoo-Sun Kim, and Kyung-Wook Paik, A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 5, No.1, pp. 9~14, Jan. 2015

2014년
125. Yongwon Choi, Jiwon Shin, Kyung-lim Suk, Young soon Kim, Il Kim, and Kyung-Wook Paik, Analysis of 3D TSV vertical interconnection using pre-applied non-conductive films, Journal of Electronic Materials, vol. 43, no.11, pp.4214-4223, Jul. 2014
124. Kim, K.W. Paik, Low-Temperature Curable Photo-Active Anisotropic Conductive Films (PA-ACFs), Journal of Electronic Materials, (2014).
123. J.W. Jang, K.L. Suk, J.H. Park, K.W. Paik, S.B. Lee, Warpage behavior and life prediction of a chip-on-flex package under a thermal cycling condition, IEEE Transactions on Components, Packaging and Manufacturing Technology, 4 (2014) 1144-1151.

2013년
122. Yoo-Sun Kim, Kiwon Lee, and Kyung-Wook Paik, Ultrasonic-Assisted Thermocompression Bonding Method of Solder Anisotropic Conductive Film Joints for Reliable Camera Module Packaging, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 3 (2013) 2156-2163.

121. Tae-Wan Kim, Sang-Hoon Lee, and Kyung-Wook Paik, Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding, JOURNAL OF NANOMATERIALS, (2013).

120. Sung Ho Song , Bo Hyun Kim , Yong Won Choi , Gwang Hoon Jun ,, B.-S.K. Dong Ju Lee , Kyung-Wook Paik , and Seokwoo Jeon *, Enhanced Thermal Conductivity of EpoxyGraphene Composites by Using Non-Oxidized Graphene Flakes with Non-Covalent Functionalization ADVANCED MATERIALS 25 (2013) 732-737.

119. Yoo-Sun Kim, and Kyung-Wook Paik, Effects of ACF Bonding Parameters on ACF Joint Characteristics for High-Speed Bonding Using Ultrasonic Bonding Method IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 3(2013) 177-182.


2012년
118. Sang-Hoon Lee, Kiwon Lee, and Kyung-Wook Paik, Study on Fine Pitch Flex-on-Flex Assembly Using Nanofiber/Solder Anisotropic Conductive Film and Ultrasonic Bonding Method IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 2(2012) 2108-2114

117. Jonghyun Kim, Yongwon Choi, and Kyung-Wook Paik, Studies on the Polymer Adhesive Wafer Bonding Method Using Photo-Patternable Materials for MEMS Motion Sensors Applications IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 2(2012) 1118-1127.

116. Jang, Park, Jin-Hyoung, Lee, Seon Young Yu, Yong-Min Kwon, Jinsu Kim, Taesung Jeong, Seogmoon Choi, Soon-Bok, Paik, Kyung-Wook A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages MICROELECTRONICS RELIABILITY 52 (2012) 1174-1181.

115. Kyoung-Lim Suk , Sung Jin Kim , Jong-Soo Kim , Kyung-Wook Paik Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)", Microelectronics Reliability, 52 (2012) 1182-1188.

114. Jae-Won Jang, Kyung-Wook Paik, , and Soon-Bok Lee, , Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 2(2012) 834-840.

113. Won-Chul Kim, Ilkka J. Saarinen, Lasse Pykari, and Kyung-Wook Paik, Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2 (2012) 884-889.

112. Seon Young Yu, Jinsu Kim, Taesung Jeong, Seogmoon Choi,, a.K.-W. Paik", Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) with an Embedded Die, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 2(2012) 625-633.

111. Chang-Kyu Chung, Soon-Bok Lee, and Kyung-Wook Paik, Effects of Conductive Particles on the Electrical Stability and Reliability of Anisotropic Conductive Film Chip-on-Board Interconnections IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 2 (2012) 359-366.

110. SeungCheol Yang, JungHo Jin, Joon-Soo Kim, Yongwon Choi, Kyung-Wook Paik , a.B.-S. Bae*, Thermally resistant UV-curable epoxy-siloxane hybrid materials for light emitting diode (LED) encapsulation Journal of Materials Chemistry, 22 (2012) 8874-8880.

109. Joon-Soo Kim, Seung-Yeon Kwak, Yongwon Choi, Kyung-Wook Paik and Byeong-Soo Bae*, High performance encapsulant for light-emitting diodes (LEDs) by a sol-gel derived hydrogen siloxane hybrid Journal of Materials Chemistry, 22 (2012) 7954-7960.

108. Kyoung-Lim Suk, Ho-Young Son, Chang-Kyu Chung, Joong Do Kim, Jin-Woo Lee, Kyung-Wook Paik, "Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)", Microelectronics Reliability, No. 52, 225-234, (2012)
107. Chang-Kyu Chung, Jae-Han Kim, Jong-Won Lee, Kyoung-Won Seo, Kyung-Wook Paik, "Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high Tg ACFs in fine-pitch chip-on-glass applications", Microelectronics Reliability, No. 52, 217-224, (2012)

2011년

106. Kiwon Lee, Ilkka J. Saarinen, Lasse Pykari, and Kyung Wook Paik, "High Power and High Reliability Flex-On-Board Assembly Using Solder Anisotropic Conductive Films Combined with Ultrasonic Bonding Technique", IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, No. 99, p. 1, (2011)
105. Kim, Il , Jang, Kyung-Woon Son, Ho-Young, Kim, Jae-Han, Paik, Kyung-Wook, "Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections", IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,Vol.1, No. 5, p. 792-797, (2011)
104. Min Hyung Lee, Yong Min Kwon , Sung Gyu Pyo , Han Choon Lee , Jae-Won Han , Kyung-Wook Paik, "Effects of metal stacks and patterned metal profiles on the electromigration characteristics in super-thin AlCu interconnects for sub-0.13 um technology", Thin Solid Films, Vol. 519, No. 11, p. 3906-3913, (2011)

2010년

103. Lee, Sangyong, Paik, Kyung-Wook, "Reduced Temperature Coefficient of Capacitance (TCC) of Embedded Capacitor Films (ECFs) for Organic Substrates using SrTiO3 and Multifunctional Epoxy", JOURNAL OF ELECTRONIC MATERIALS, Vol. 39, No. 8, p. 1358-1363, (2010)
102. Chung, Chang-Kyu, Paik, Kyung-Wook, "Effects of the Degree of Cure on the Electrical and Mechanical Behavior of Anisotropic Conductive Films", JOURNAL OF ELECTRONIC MATERIALS, Vol. 39, No. 4, p. 410-418, (2010)

2009년

101. Kiwon Lee, Hyoung-Joon Kim, Myung-Jin Yim, and Kyung-Wook Paik, "Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection ", IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, Vol. 32, No. 4, p. 241-247, (2009)
100.
Kyung-Woon Jang and Kyung-Wook Paik, "Effects of Heating Rate on Material Properties of Anisotropic Conductive Film (ACF) and Thermal Cycling Reliability of ACF Flip Chip Assembly",IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, Vol. 32, No. 2, p. 339-346, (2009)
99.
Min hyung Lee, Han Choon Lee, Chul Ho Park, Jae-Won Han, and Kyung-Wook Paik, "Improvement of Device Performance by Optimizing the Advanced DCV Process Condition in Dual-Damascene Cu Interconnects", Journal of The Electrochemical Society, Vol. 156, No. 8, p. 644-647, (2009)
98. Chang-Kyu Chung and Kyung-Wook Paik, "Nonconductive Films (NCFs) With Multifunctional Epoxies and Silica Fillers for Reliable NCFs Flip Chip on Organic Boards (FCOBs)", IEEE Transaction on Electronic Packaging Manufacturing, Vol. 32, No. 2, p. 65-73, (2009)
97. Kyung-Woon Jang and Kyung-Wook Paik, "Effects of Anisotropic Conductive Film Viscosity on ACF Fillet Formation and Chip-On-Board Packages", IEEE Transaction on Electronic Packaging Manufacturing, Vol. 32, No. 2, p. 74-80, (2009)
96. Son, Ho-Young, Kim, Ilho, Lee, Soon-Bok, Jung, Gi-Jo, Park, Byung-Jin, Paik, Kyung-Wook, "Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 mu m pitch applications", JOURNAL OF APPLIED PHYSICS, Vol. 105, No. 1, Article Number: 013522 , (2009)

2008년

95. Yim, Myung Jin, Li, Yi, Moon, Kyoung-sik, Paik, Kyung Wook, Wong, C. P, "Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging", Vol. 22, No. 14, p. 1593-1630, (2008)
94. Son, Ho-Young, Jung, Gi-Jo, Park, Byung-Jin, Paik, Kyung-Wook, "A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates", JOURNAL OF ELECTRONIC MATERIALS, Vol. 37, No. 12, p. 1832-1842, (2008)
93. Chang-Kyu Chung, Yong-Min Kwon, Il Kim, Ho-Young Son, Kyo-Sung Choo, Sung-Jin Kim, and Kyung-Wook Paik, "Theoretical prediction and experimental measurement of the degree of cure of anisotropic conductive films (ACFs) for chip-on-flex (COF) applications", Journal of ELECTRONIC MATERIALS, Vol. 37, No. 10, p. 1580-1590, (2008)
92. Kyung-Woon Jang, Hyoung-Joon Kim, Chang-Kyu Chung, and Kyung-Wook Paik, Member, IEEE, "Effects of thermal cycling on material properties of nonconductive pastes (NCPs) and the relationship between material properties and warpage behavior during thermal cycling", IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 31, NO. 3, p.559-565 (2008)
91. Kim, Hyoung-Joon, Paik, Kyung-Wook, "Adhesion and reliability of anisotropic conductive films (ACFs) joints on organic solderability preservatives (OSPs) metal surface finish", Journal of Electronic Materials, vol.37 No.7 P.1003-1011 (2008)
90. Hwang, J. S., Yim, M. J., Paik, K. W. "Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application", Microelectronics Reliability, vol.48 No.2 P.293-299 (2008)
89. Kyung-Woon Jang and Kyung-Wook Paik, "Screen printable epoxy/BaTiO3 embedded capacitor pastes with high dielectric constant for organic substrate applications", Journal of Applied Polymer Science, Vol. 110, No. 2, pp. 798-807 (2008)
88. Kyung-Woon Jang, Chang-Kyu Chung, Woong-Sun Lee, and Kyung-Wook Paik, "Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications", Microelectronics Reliability, Vol. 48, No. 7, pp. 1052-1061 (2008)

2007년

87. Yim, Myung Jin, Chung, Chang-Kyu, Paik, Kyung Wook, "Effect of conductive particle properties on the reliability of anisotropic conductive film for chip-on-glass applications" IEEE Transaction on Electronics Packaging Manufacturing, vol.30 No.4 p.306-312 (2007)
86. Ho-Young Son, Chang-Kyu Chung, Myung-Jin Yim, Jin-Sang Hwang, Gi-Jo Jung, Jun-Kyu Lee and Kyung-Wook Paik, "Wafer level flip chip packages using pre-applied anisotropic conductive films (ACFs)", IEEE Transaction on Electronics Packaging Manufacturing, Vol. 30, No. 3, pp.221-227 (2007)
85. Chang-Kyu Chung, Woon-Seong Kwon, Kyung-Woon Jang, Jin-Hyoung Park, Soon-Bok Lee, and Kyung-Wook Paik, "Effects of the functional groups of non-conductive films (NCFs) on material properties and reliability of NCF flip-chip-on-organic boards", IEEE Transactions on Components and Packaging Technologies, vol.30 no.3 p. 464-471(2007)
84. Sangyong Lee, Jin-Gul Hyun, Hyungsoo Kim, Kyung-Wook Paik, "A Study on Dielectric constants of Epoxy/SrTiO3 Composites for Embedded Capacitor Films (ECFs)", IEEE Transactions on Advanced Packaging,(Accepted) (2007.02.08)
83. Myung-Jin Yim, Jin-Sang Hwang, and Kyung-Wook Paik, "Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications", International Journal of Adhesion and Adhesives, Vol. 27, No.1, pp.77-84 (2007)
82. Hyoung-Joon Kim, Chang-Kyu Chung, Yong-Min Kwon, Myung-Jin Yim, Soon-Min Hong, Se-Young Jang, Young-Joon Moon, and Kyung-Wook Paik, "Study of the formation of bubbles in rigid substrate-flexible substrate bonding using anisotropic conductive films and the bubble effects on anisotropic conductive film joint reliability", Journal of Electronic Materials, Vol. 36, No. 1, pp.56-64 (2007)

2006년

81. Jin-Hyoung Park, Chang-Kyu Chung, Kyung-Wook Paik, and Soon-Bok Lee, , "Effect of high glass transition temperature on reliability of non-conductive film (NCF)", Key Engineering Materials, Vol. 326/328, No.1, pp.517-520 (2006)
80. Sang-Ah Gam, Hyoung-Joon Kim, Jong-Soo Cho, Yong-Jin Park, Sung-Hoon Kim, Jeong-Tak Moon, and Kyung-Wook Paik, "Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability", Journal of Electronic Materials, Vol. 35, No. 11, pp.2048-2055 (2006)
79. Myung-Jin Yim and Kyung-Wook Paik, "Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications", International Journal of Adhesion and Adhesives, Vol. 26, No. 5, pp.304-313 (2006.08)
78. Jae-Woong Nah, Fei Ren, Kyung-Wook Paik, and K. N. Tu, "Effect of electromigration on mechanical shear behavior of flip chip solder joints", Journal of Materials Research , Vol. 21, No. 3, pp.698-702, (2006.03)
77. Woon-Seong Kwon, Suk-Jin Ham, and Kyung-Wook Paik, "Deformation mechanism and its effect on electrical conductivity of ACA filp chip package under thermal cycling condition: An experimental study", Microelectronic Reliability, Vol. 46, No. 2/4, pp.589-599 (2006)
76. Se-Young Yang, Young-Doo Jeon, Soon-Bok Lee, and Kyung-Wook Paik, "Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages", Microelectronics Reliability, Vol.46, No.1 pp.512-522 (2006. 01)
75. Moon-Gi Cho, Kyung-Wook Paik, Hyuck-Mo Lee, Seong-Woon Booh, and Tea-Gyu Kim, "Interfacial reaction between 42Sn-58Bi solder and electroless Ni-p/immersion Au under bump metallurgy during aging", Journal of Electronic Materials, Vol.35, No.1, pp.35-40 (2006.01)
74. Myung-Jin Yim, Woon-seong Kwon, and Kyung-Wook Paik, "Effect of filler content on the dielectric properties of anisotropic conductive adhesive materials for high frequency flip chip interconnection", Materials Science and Engineering B - Solid State Materials for Advanced Technology, Vol. 126, No. 1, pp.59-65 (2006.01)
73. Woon-Seong Kwon and Kyung-Wook Paik, "Experimental analysis of mechanical and electrical characteristics of metal-coated conductive spheres for anisotropic conductive adhesives (ACAs) interconnection", IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 3, pp.528-534 (2006)
72. Woon-Seong Kwon, Se-Young Yang, Soon-Bok Lee, and Kyung-Wook Paik, "Contraction stresses development of anisotropic conductive films (ACFs) flip chip interconnection: prediction and measurement", IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 3, pp.688-695 (2006)

2005년

71. Myung-Jin Yim, In-Ho Jeong, Hyung-Kyu Choi, Jin-Sang Hwang, Jin-Yong Ahn, Woon-Seong Kwon, and Kyung-Wook Paik, "Flip chip interconnection with anisotropic conductive adhesives for RF and high frequency applications", IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 4, pp.789-796 (2005.12)
70. Jin-Sang Hwang, Myung-Jin Yim, and Kyung-Wook Paik, "Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly", Journal of Electronic Materials, Vol. 34, No. 11, pp.1455-1461 (2005)
69. Se-Young Yang, Woon-Seong Kwon, Soon-Bok Lee, and Kyung-Wook Paik, "Chip warpage damage model for ACA film type electronic packages", Key Engineering Materials, Vol. 297/300, No. 2, pp.887-892 (2005)
68. Sung-Dong Cho, Kyung-Woon Jang, Jin-Gul Hyun, Sang-Yong Lee, Kyung-Wook Paik, Hyung-Soo Kim, and Joung-Ho Kim, "Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates", IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 4, pp.297-303 (2005)
67. Jin-Gul Hyun, Sung-Dong Cho, and Kyung-Wook Paik, "A study on temperature dependence of epoxy/BaTiO3 composite embedded capacitor films (ECFs)", Journal of Electronic Materials, Vol. 34, No. 9, pp. 1264-1269 (2005.09)
66. Ho-Young Son, Jae-Woong Nah, and Kyung-Wook Paik, "Formation of Pb/63Sn solder bumps using a solder droplet jetting method", IEEE Transaction on Electronics Packaging Manufacturing, Vol. 28, No. 3, pp.274-281 (2005.07)
65. Woon-Seong Kwon, Suk-Jin Ham, Myung-Jin Yim, Soon-Bok Lee, and Kyung-Wook Paik, "Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation", ASME Journal of electronic packaging, Vol. 127, No. 2, pp.86-90 (2005.06)
64. Sung-Dong Cho, Sang-Yong Lee, Jin-Gul Hyun, and Kyung-Wook Paik, "Comparison of Theoretical Predictions and Experimental Values of the Dielectric Constant of Epoxy/BaTiO3 Composite Embedded Capacitor Films", Journal of Materials science, vol.16 No.2 pp.77-84 (2005)
63. Myung-Jin Yim, Hyoung-Joon Kim, and Kyung-Wook Paik, "Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications", Journal of Electronic Materials, Vol. 34, No. 8, pp.1165-1171 (2005)
62. Young-Doo Jeon, Kyung-Wook Paik, Adreas Ostmann, and Herbert Reichl, "Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P UBMs", Journal of Electronic Materials, Vol. 34, No. 1, pp. 80-90 (2005.01)

2004년

61. Jun-Ho Lee, Seung-Young Ahn, Woon-Seong Kwon, Kyung-Wook Paik, and Joung-Ho Kim, "Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement", IEICE Transactions on Electronics, Vol. 87, No. 9, pp.1621-1627 (2004.09)
60. Hyoung-Joon Kim, Jong-Soo Cho, Yong-Jin Park, Jin Lee, and Kyung-Wook Paik, "Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability", Journal of Electronic Materials, Vol. 33, No. 10, pp.1210-1218 (2004)
59. Baik-Woo Lee, Woo-Soon Jang, Dong-Won Kim, Jeung-hyun Jeong, Jae-Woong Nah, Kyung-Wook Paik, and Dongil Kwon, "Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages", Materials Science and Engineering A , Vol. 380, No.1-2 pp. 231-236 (2004.08.25)
58. Woon-Seong Kwon ,Hyoung-Joon Kim, Kyung-Wook Paik, Se-Young Jang, and Soon-Min Hong, "Mechanical reliability and bump degradation of flip chip packages using BCB (CycloteneTM) bumping dielectrics under temperature cycling", Transaction of ASME Journal of Electronic Packaging, Vol. 126, No. 2, pp.202-207 (2004)
57. Kyung-Woon Jang, Woon-Seong Kwon, Myung-Jin Yim, and Kyung-Wook Paik, "Effects of silica filler and diluent on material properties and reliability of non-conductive pastes (NCPs) for flip-chip applications", IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 3, pp.608-615 (2004)
56. Woon-Seong Kwon and Kyung-Wook Paik, "Contraction stress build-up of anisotropic conductive films for flip chip interconnection: effect of thermal and mechanical properties of ACFs", Journal of Applied Polymer Science, Vol. 93, No. 6, pp.2634-2641 (2004.09)
55. Woon-Seong Kwon and Kyung-Wook, Paik, "Fundamental understanding of ACF conduction establishment with emphasis on thermal and mechanical analysis", International Journal of Adhesion and Adhesives, Vol. 24, No. 2, pp.135-142 (2004)
54. Woon-Seong Kwon, Se-Young Jang, and Kyung-Wook Paik, "Exothermic reaction induced eutectic Pb/Sn solder ball melting in the underfill curing process", IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 1, pp.172-176 (2004)
53. Sung-Dong Cho, Joo-Yeon Lee, Jin-Gul Hyun, and Kyung-Wook Paik, "Study on epoxy/BaTiO3 composite embedded capacitor films (ECFs) for organic substrate applications", Materials Science and Engineering B, Vol. 110, No. 3, pp. 233-239 (2004.07)
52. Myung-Jin Yim, Jin-Sang Hwang, Jin-Gu Kim, Jin-ong Ahn, Hyoung-Joon Kim, Woon-Seong Kwon, and Kyung-Wook Paik, "Highly reliable flip chip on flex package using multi-layered anisotropic conductive film", Journal of Electronic Materials, Vol. 33, No. 1, pp.76-82 (2004)
51. Jae-Woong Nah, Jong Hoon Kim, Hyuck Mo lee, and Kyung-Wook Paik, "Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure", Acta Materialia, Vol.52, No.1, pp.129-136 (2004.01.05)

2003년

50. Jae-Woong Nah, Kyung-Wook Paik, Jong-Ook Suh and King-Ning Tu, "Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints", Journal of Applied Physics, Vol. 94, No. 12, pp. 7560-7566 (2003.12.15)
49. Myung-Jin Yim, Jin-Sang Hwang, Woon-seong Kwon, Kyung-Woon Jang, and Kyung-Wook Paik, "Highly Reliable Non-Conductive Adhesives for Flip Chip CSP Applications", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No. 2, pp. 150-155 (2003)
48. Se-Young Jang, Juergen Wolf, Oswin Ehrmann, Heinz Gloor, Herbert Reichl, and Kyung-Wook Paik, "CrCu based UBM (under bump metallurgy) study with electroplated Pb/63Sn solder bumps interfacial reaction and bump shear strength", IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 1, pp.245-254 (2003.03)
47. Hyoung-Joon Kim, Joo-Yeon Lee, Kyung-Wook Paik, Kwang-Won Koh, Jinhee Won, Sihyun Choe, Jin Lee, Jung-Tak. Moon, and Yong-Jin Park, "Effects of Cu/Al intermetallic compound (IMC) formation on Cu wire and Al pad bondability", IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 2, pp.367-374 (2003)
46. Seok-Pil Jang, Sung-Jin Kim, and Kyung-Wook Paik, "Experimental investigation of thermal characteristics for a microchannel heat sink subject to an impinging jet, using a micro-thermal sensor array", Sensors and Actuators A, Vol. 105, no. 2, pp. 211-224 (2003)
45. Jae-Woong Nah, Tae-Kyung Hwang, Won-Hoe Kim and Kyung Wook Paik, "A study on coining processes of solder bumps on organic substrates", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No. 2, pp.166-172 (2003.04)
44. Baik-Woo Lee, Jeung-Hyun Jeong, Woo-Soon Jang, Ju-Young Kim, Dong- Won Kim, Dong-Il Kwon, Jae-Woong Nah and Kyung-Wook Paik, "Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis", International Journal of Modern Physics B, Vol. 17, Nos. 8-9, pp. 1983-1988 (2003.04.10)
43. Young-Doo Jeon, Sabine Nieland, Adreas Ostmann, Herbert Reichl, and Kyung-Wook Paik, "Study on interfacial reactions between electroless Ni-P UBM and 95.5Sn-4.0Ag-0.5Cu alloy", Journal of Electronic Materials, Vol.32, No. 6 pp. 548-557 (2003)

2002년

42. Won-Kyoung Choi, Se-Young Jang, Kyung-Wook Paik, Jong-Hoon Kim, and Hyuck-Mo Lee, "Grain morphology of intermetallic compounds at solder joints", Journal of Materials Research, Vol. 17, No. 3, pp.597 - 599 (2002.03)
41. Young-Doo Jeon, and Kyung-Wook Paik, "Stresses in electroless Ni-P films for electronic packaging applications", IEEE Transactions on Components and Packaging Technologies. Vol.25, No.1, pp.169-173 (2002.03)
40. Jae-Woong Nah and Kyung-Wook Paik, "Investigation of flip chip under bump metallization systems of Cu pads", IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 1, pp.32-37 (2002.03)
39. Hyoung-Soo Ko, Jae-Woong Nah, Kyung-Wook Paik, and Y. Park "Effects of the polymer residues on via contact resistance after reactive ion etching", Journal of Vacuum Science and Technology B, Vol. 20, No. 3, pp.1000-1007 (2002)
38. Young-Doo Jeon, Kyung-Wook Paik, Kyoung-Soon Bok, Woo-Suk Choi, and Chul-Lae Cho, "Studies on the electroless nickel UBM - solder interfacial reaction and their effects on flip chip solder joint reliability", Journal of Electronic Materials, Vol. 31, No. 5, pp.520-528 (2002.01)
37. Se-Young Jang, Juergen Wolf, and Kyung-Wook Paik, "Under bump metallurgy study for Pb-free bumping", Journal of Electronic Materials, Vol. 31, No. 5, pp.478-487 (2002.05)
36. Se-Young Jang, Juergen Wolf, Oswin Ehrmann, Heinz Gloor, Herbert Reichl, and Kyung-Wook Paik, "Pb-free Sn/3.5Ag electroplating bumping process and UBM (under bump metallization)", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 25, No. 3, pp.193-202 (2002.07)
35. Se-Young Jang, Juergen Wolf, Oswin Ehrmann, Herbert Reichl, Kyung-Wook Paik, "Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study", Microsystem Technologies, Vol. 7, No. 5-6, pp.269-272 (2002.01)

2001년

34. Hyoung-Soo Ko, Im-Sik Chung, and Kyung-Wook Paik, "A study on the adhesion enhancement of polyetherimide to Si wafer using an Al-chelate treatment during multichip module fabrication", Materials Science and Engineering B, Vol. 83, No. 1-3, pp.111-118 (2001)
33. Myung-Jin Yim and Kyung-Wook Paik, "Effect of non-conducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates", IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 1, pp.24-32 (2001.03)
32. Se-Young Jang and Kyung-Wook Paik, "Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on various UBM systems", IEEE Transactions on Electronic Packaging Manufacturing, Vol. 24, No. 4, pp.269-274 (2001.10)

2000년

31. Hyoung-Soo Ko, Jin-Su Kim, Hyun-Gook Yoon, Se-Young Jang, Sung-Dong Cho, and Kyung-Wook Paik, "Development of three-dimensional memory die stack packages using polymer insulated sidewall technique", IEEE Transactions on Advanced Packaging, Vol. 23, No. 2, pp.252-256 (2000, May)
30. Woong-Hwan Ryu, Myung-Jin Yim, Seung-Young Ahn, Jun-Ho Lee, Woo-Poung Kim, Kyung-Wook Paik, and Joung-Ho Kim, "High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm", IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, pp.542-545 (2000.09)
29. Myung-Jin Yim, Young-Doo Jeon, and Kyung-Wook Paik, "Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 23, No. 3, pp. 171-176 (2000. 07)
28. Jin-Su Kim, Bong-Kyu Kim, Ji-Hyuk Lim, and Kyung-Wook Paik, "The finite element analysis of internal stresses during sequential build-up of lamination-based thick-film multilayer substrates", Journal of Materials Science: Materials in Electronics, Vol. 11, pp.45-56 (2000)
27. Ji-Hyuk Lim, Jin-Su Kim, Kyung-Wook Paik and Yoon-Yong Earmme, "A thermomechanical analysis of MCM-D substrate of polymer and metal multilayer", Key Engineering Materials, Vol. 183-187, pp.1123-1128 (2000)

1999년

26. Myung-Jin Yim and Kyung-Wook Paik, "The contact resistance and reliability of anisotropically conductive film (ACF)", IEEE Transactions on Advanced Packaging, Vol. 22, No. 2, pp166-173 (1999.05)
25. Ki-Hwan Kim, Jong-Man Park, Chang-Kyu Kim, Gerald L. Hofman and Kyung-Wook Paik, "Thermal compatibility studies of U3Si2 dispersion fuels prepared with centrifugally atomized power", Journal of Nuclear Materials, Vol. 270, No. 4, pp.315-321 (1999.07)
24. Myung-Jin Yim, Woong-Hwan Ryu, Young-Doo Jeon, Jun-Ho Lee, Seung-Young Ahn, Joung-Ho Kim and Kyung-Wook Paik, "Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications", IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 4, pp.575-581 (1999.12)
23. Jin-Su Kim, Seung-Hwan Oh, and Kyung-Wook Paik "The multilayer-modified Stoney's formula for the laminated polymer composites on a silicon substrate", Journal of Applied Physics, Vol. 86, No. 10, pp.5474-5479 (1999.11)
22. Jin-Su Kim, Hyun-Sik Seo, and Kyung-Wook Paik, "A quantitative analysis of the stress relaxation effect of thermoplastics in multilayer substrates", IEEE Transactions on Advanced Packaging, Vol. 22, No. 4, pp.638-641 (1999.11)
21. Sung-Dong Cho, and Kyung-Wook Paik, "Study on the amorphous Ta2O5 thin film capacitors deposited by dc magnetron reactive sputtering for multichip module applications", Materials Science and Engineering B, Vol. 67, No. 3, pp. 108-112 (1999)
20. Jin-Su Kim, Ji-Hyuk Lim, Yoon-Yong Earmme, and Kyung-Wook Paik, "Thermomechanical stress analysis of laminated thick-film multilayer substrates", Applied Physics Letter, Vol. 74, No. 23, pp.3507-3509 (1999.06)
19. Jung-Hoon Lee, Lee-Ju Park, Sang-Beom Kim, and Kyung-Wook Paik, "The effect of reduction ratio of hot rolling on texture and secondary recrystallization of MA 754 plate", Journal of Materials Science Letter, Vol. 18, pp.1645-1648 (1999)

1998년

18. Hyoung-Soo. Ko, Lee-Ju Park, Young-Gil Kim, J. H. Tundermann, and Kyung-Wook Paik, "Influence of rhenium on the microstructures and mechanical properties of a mechanically alloyed oxide dispersion-strengthened nickel base superalloy", Journal of Materials Science, Vol. 33, pp.3361-3370 (1998)
17. Myung-Jin Yim and Kyung-Wook Paik, "Design and understanding of anisotropic conductive films (ACF’s) for LCD packaging, IEEE Transactions on Components, Packaging, and Manufacturing Technology-part A, Vol. 21, No. 2, pp.226-234 (1998.06)
16. Soon-Jin Cho and Kyung-Wook Paik, "Oxidation studies on a Cu-based lead frame alloy between 150°C and 300°C", Scripta Materialia, Vol. 38, No. 7, pp.1149-1154 (1998)
15. Se-Young Jang and Kyung-Wook Paik, "Eutectic Sn/Pb solder bump and under bump metallurgy: interfacial reaction and adhesion", Solders and Surface Mount Technologies, Vol. 10, No. 3, pp.29-37 (1998)
14. Sang-Beom Kim, Kyung-Wook Paik, and Young-Gil Kim, "Effect of Mo substitution by W on high temperature embrittlement characteristics in duplex stainless steels", Materials Science and Engineering-A, Vol. A247, pp.67-74 (1998)
13. Jung-Hoon Lee, Kyung-Wook Paik, Lee-Ju Park, J. H. Tundermann and J.J. deBarbadillo, Young-Gil. Kim, "The effect of high temperature deformation conditions on the secondary recrystallization of MA754 plate", Scripta Materialia, Vol. 38, No. 5, pp.789-794 (1998)

1997년

12. Soon-Jin Cho and Kyung-Wook Paik, "The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound", IEEE Transactions on Components, Packaging, and Manufacturing Technology-part B, Vol. 20, No. 2, pp.167-175 (1997.05)
11. Ki-Hwan Kim, Don-Bae Lee, Chang-Kyu Kim, Gerad L. Hofman, and Kyung-Wook Paik, "Thermal compatibility of centrifugally atomized U-Mo powders with Al in a dispersion fuel", Nuclear Engineering and Design, Vol. 178, pp.111-117 (1997.03)
10. Ki-Hwan Kim, Don-Bae Lee, Chang-Kyu Kim, Gerad L. Hofman, and Kyung-Wook Paik, "Characteristics of U3Si and U3Si2 powder prepared by centrifugal atomization", Journal of Nuclear Science and Technology, Vol. 34, No. 12, pp.1-6 (1997)
9. Ki-Hwan Kim, Chang-Kyu Kim, Gerad L. Hofman, and Kyung-Wook Paik, "Characterization of U-2wt% Mo and U-10% Mo alloy powders prepared by centrifugal atomization", Journal of Nuclear Materials, Vol. 245, No. 2-3 pp.179-184 (1997)
8. Mann-Joo Huh, Sang-Beom Kim, Kyung-Wook Paik, and Young-Gil Kim, "Effect of Mo substitution by W on impact property of heat affected zone in Duplex stainless steels", Scripta Materialia, Vol. 36, No. 7, pp.775-781 (1997)

1995년

7. A. Mogro-Campero, Kyung-Wook Paik, and L.G. Turner, "Degradation of thin films of YBa2Cu3O7 by annealing in air and in vacuum", Journal of Superconductivity, Vol. 8, pp.95-98 (1995)
6. Mary J. Li, Xin Wu, Michael Pecht, Kyung-Wook Paik, and Edward Bernard, "Relative humidity cycle testing on GE-HDI", International Journal of Microelectronics Packaging: Materials and Technologies, Vol. 1, No. 1, pp.13-34 (1995)
5. Michael Pecht, Xin Wu, Kyung-Wook Paik, and S. Navin Bhandarkar, "To cut or not to cut: A thermomechanical stress analysis of polyimide thin film on ceramic structures", IEEE Transactions on Components, Packaging, and Manufacturing Technology-part B, Vol. 18, No. 1, pp.150-153 (1995)

1994년

4. Kyung-Wook Paik and Antonio Mogro-Campero, "Studies on the high-temperature superconductor(HTS)/metal/polymer dielectric interconnect structure for packaging applications, IEEE Transactions on Components, Packaging, and Manufacturing Technology-part B, Vol. 17, No. 3, pp.435-441 (1994)

1993년

3. Kyung-Wook Paik, Herbert S. Cole, Richard J. Saia, and John J. Chera, "Studies on Metal/Benzocyclobutene(BCB) interface and adhesion", Journal of Adhesion Science and Technology, Vol. 7, No. 5, pp.403-415 (1993)

1990년

2. Kyung-Wook Paik and A. L. Ruoff, "Adhesion enhancement of thin copper film on polyimide modified by oxygen reactive ion beam etching", Journal of Adhesion Science and Technology, Vol. 4, No. 6, pp.465-474 (1990)

1988년

1. Kyung-Wook Paik and A. L. Ruoff, "Adhesion enhancement of polyimide on copper by Ar ion beam etching of copper", Journal of Adhesion Science and Technology, Vol. 2, No. 4, pp.245-253 (1988)