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Cho, Soon Jin (Ph.D.)

삼성전기 중앙연구소 기판랩
Email : soonjin.cho@samsung.com
M.S. dissertation :
"Effects of Al and Cr on the phase transformation and mechanical properties of cryogenic Fe-19Mn-(5,13)Cr-Al-0.2C-0.5Si steels"
Ph.D. dissertation :
"A Study on the low temperature oxidation of Cu-base leadframe and Cu/EMC Interface adhesion"

Kim, Sang Beom (Ph.D.)

이화다이아몬드공업(주) 기술연구소
Email : sbkim@ehwadia.co.kr
Ph.D. dissertation :
"A study on the high temperature embrittlement, corrosion resistance, and weldability of W-containing duplex stainless steels"

Jeon, Woo Seok (M.S.)

삼성전자 LCD 총괄
Email : junws@korea.com
M.S. dissertation :
"A study on the thermo-mechanical stress of MEMS device packages"

Lee, Jeong Hoon (Ph.D.)

두산중공업(주) 주단/BG
Email : jh.lee@doosan.com
Ph.D. dissertation :
"The effects of hot deformation conditions on the secondary recrystallization behavior and mechanical properties at elevated temperature in mechanically alloyed oxide dispersion strengthened Ni-base superalloy MA 754 "

Yoon, Hyun Gook (M.S.)

LG화학 기술연구소
M.S. dissertation :
"A study on the effect of polyetherimide surface treatment on the adhesion and high temperature/high humidity reliability of MCM-D interface"

Kim, Jin Su (Ph.D.)

Email : jin.kim@yale.edu
Ph.D. dissertation :
"Thermo-mechanical stress analysis of lamination-based silicon monolithic MCM-D substrates"

Eom, Ji Yong (M.S.)

삼성SDI
Email : jiyong.eom@samsung.com

Ko, Hyung Soo (Ph.D.)

삼성전자 반도체 연구소
Email : hyoungsoo.ko@samsung.com
M.S. dissertation :
"Influences of rhenium addition on the mechanical properties and microstructures of MA ODS nickel-base superalloy"
Ph.D. dissertation :
"A Study on the Polymer Dielectric Layer Formation and Metal/Polymer Via Interconnection in MCM-D Substrate Fabrication"

Yim, Myung Jin (Ph.D.)

Numonyx
Email : myung.jin.yim@numonyx.com
M.S. dissertation :
"A Study on the electrical conduction mechanism and reliability of anisotropically conductive films(ACFs) for LCD packaging applications"
Ph.D. dissertation :
"Electrical and mechanical properties of anisotropic conductive polymer adhesives for electronic packaging interconnection materials"

Jang, Se Young (Ph.D.)

삼성전자 정보통신총괄 무선사업부 H/W Platform2 그룹
Email : seyoung.jang@samsung.com
M.S. dissertation :
"Interfacial studies on the electroplated eutectic Pb/Sn flip-chip solder bump and UBM(Under Bump Metallurgy)"
Ph.D. dissertation :
"Studies on the Electroplated Flip Chip Solder Bumping Processes and Solder/UBM (Under Bump Metallization) Interfacial Reactions"

Lee, Joo Yeon (M.S.)

Email : joylyn.lee@gmail.com
M.S. dissertation :
"Formation and characterization of Epoxy/BaTiO_3 composite embedded capacitor film for PWB application"

Cho, Sung Dong (Ph.D.)

삼성전자 반도체총괄 시스템LSI
Email : sd0424.cho@samsung.com
M.S. dissertation :
"A study on the amorphous Ta2O5 thin film capacitors deposited by DC reactive magnetron sputtering for MCM applications"
Ph.D. dissertation :
"A Study on epoxy/BaTiO_3 composite embedded capacitor films (ECFs)"

Nah, Jae Woong (Ph.D.)

IBM T. J. Watson Research Center
Email : jwnah@hotmail.com
Ph.D. dissertation :
"Studies on solder bumps coining processes and reliability of assembled flip chip"

Jeon, Young Doo (Ph.D.)

NVIDIA
Email : yjeon@nvidia.com
Ph.D. dissertation :
"Studies on interfacial reactions and reliabilities of various solder bumps on electroless Ni-P UBMs"

Jo, Moon Gi (M.S.)

KAIST 신소재공학과 전산재료과학 연구실
Email : indigomoon@kaist.ac.kr
M.S. dissertation :
"Effects of Bi on Interfacial Reaction and Bump Strength in Electroless Ni-P UBM/Pb-free Solder Bumps"

Kwon, Woon Seong (Ph.D.)

삼성전자 반도체총괄 시스템LSI
Email : woonseong.kwon@samsung.com
M.S. dissertation :
"Microwave Frequency Measurement and Modeling of Flip Chip Interconnects"
Ph.D. dissertation :
"Electro-thermo-mechanical behavior and reliability of anisotropic conductive polymer adhesives for electronic packaging applications"

Hwang, Jin Sang (Ph.D.)

Ph.D. dissertation :
"Composition, microstructure, and reliability of anisotropic conductive film (ACF) for flip chip on organic substrate application"

Gam, Sang Ah (M.S.)

University of Pennsylvania, Dept. of materials sci. & eng. Ph.D. candidate
Email : sangah@seas.upenn.edu
M.S. dissertation :
"Effects of Cu and Pd Addition on Au Bonding Wire/Al Pads Interfacial Reactions and Bond Reliability"

Kim, Hyoung Joon (Ph.D.)

Email : kim.hyoungjoon@gmail.com
M.S. dissertation :
"Effects of Cu/Al intermetallic compound (IMC) formation on Cu wire and Al pad bondability"
Ph.D. dissertation :
"A Study on the Interface of Organic Rigid Substrates and Flexible Substrates Bonding using Anisotropic Conductive Adhesives"

Han, Seung Hun (M.S.)

삼성전기
M.S. dissertation :
"A Study on CNT/Epoxy Composite Films"

Jang, Kyung Woon (Ph.D.)

기술총괄 생산기술연구소 금형기술센터
Email : amiha@kaist.ac.kr
M.S. dissertation :
"Effect of silica filler and diluent on material properties and reliability of non-conductive pastes (NCPs) for flip-chip applications"
Ph.D. dissertation :
"Material Properties of Anisotropic Conductive Adhesives (ACAs) and Flip Chip Assembly Reliability for Chip-on-Board (COB) Applications"

Son, Ho Young (Ph.D.)

SK하이닉스
Email : hyson@kaist.ac.kr
M.S. dissertation :
"Studies on fabrication of jetted eutectic Pb/Sn solder bumps"
Ph.D. dissertation :
"Studies on Assembly and Reliability of Cu/SnAg Double-Bump Flip Chip on Organic Substrates for Fine Pitch Applications"

Song, Min Seok (M.S.)

삼성전자 반도체총괄 메모리사업부
Email : songms@kaist.ac.kr
M.S. dissertation :
"Oxidation Phenomena and Bond Reliability at Fine Au Wire/Al Pad interface"


Jang, Jong Min (M.S.)

삼성전자 반도체총괄 메모리사업부
Email : songms@kaist.ac.kr
M.S. dissertation :
"B-stage epoxy/BaTiO3 내장형 커퍼시터의 재료, 공정 및 전극 디자인 최적화"


Chung, Chang Kyu (Ph.D.)

삼성전자 생산기술연구소
Email : ckchung@kaist.ac.kr
Ph.D. dissertation :
"Effects of the Functional Groups of Non-Conductive Film(NCFs) on Materials Properties and Reliabilities of NCFs Flip-Chip-On-Organic Boards"

Hyun Jin Gul (Ph.D.)

삼성전기
Email : bgbng00@gmail.com
Ph.D. dissertation :
"고유전율 저 공차특성 내장형 커패시터 재료 및 공정에 대한 연구"


Lee, Sang Yong (Ph.D.)

SK하이닉스
Email : nike@kaist.ac.kr
Ph.D. dissertation :
"A Study on Material Properties and Reliablity of Epoxy/BaTiO3 Embedded Capacitor Films (ECFs) in Organic Substrate"


Kwon, Yong Min (Ph.D.)

삼성LED
Email : Okita@kaist.ac.kr
Ph.D. dissertation :
"Studies on the effects of material design parameters on the board level reliabilities of wafer level chip size packages (WLCSP)"

Kim, Won Chul (M.S.)

Email :wk1576@kaist.ac.kr
M.S. dissertation :
"A study on the Characteristics of Solder Anisotropic Conductive Film (ACF) Flex-On-Board (FOB) Joints using an Ultrasonic Bonding Method"

Lee, Ki Won (Ph.D.)

와이브레인
Email :
Ph.D. dissertation :
"(A) Study on room temperature ultrasonic (US) bonding method for high-density Flex-on-Board Assembly using Anisotropic Conductive Films (ACFs)"

Kim, Il (Ph.D.)

삼성전자
Email : konezone@kaist.ac.kr
Ph.D. dissertation :
"A Study on Low Temperature Curable Anisotropic Conductive Films (ACFs) with Photo-active Curing Agents (PA-ACFs)"

Park, Yong Sung (Ph.D.)

삼성전자
Email :
Ph.D. dissertation :
"미세 무연 솔더볼이 계면 반응 및 솔더 조인트 신뢰성에 미치는 영향에 대한 연구"

Suk, Kyoung-Lim (Ph.D.)

삼성전자
Email : stones01@kaist.ac.kr
Ph.D. dissertation :
"A Study on the Effects of Nanofiber Anisotropic Conductive Adhesive (Nanofiber ACA) Properties on Fine Pitch Interconnection Stability of ACA Flip-chip Assemblies"

Choi, Yong Won (Ph.D.)

삼성전자
Email :yongwonchoi@kaist.ac.kr
Ph.D. dissertation :
"A Study on the Interconnection Properties of 3D TSV Chip using Non-Conductive Films(NCFs) with Thermal Acid Generation(TAG)"

Kim, Seung Ho (Ph.D.)

SK하이닉스
Email : dedoop1@kaist.ac.kr
Ph.D. dissertation :
"A Study on Solder Anisotropic Conductive Film(ACF) using Thermal Acid Generator(TAG) for High Power and Reliable Flex-On-Board(FOB) Assemblies"

Shin, Ji Won (Ph.D.)


삼성전자
Email : jwon08@kaist.ac.kr
Ph.D. dissertation :
"A Study on Non-conductive Film(NCF) for Fine-pitch Cu-pillar/Sn-Ag Bump Interconnection"

Kim, Yu Sun (Ph.D.)

SK 하이닉스
Email : kys870505@kaist.ac.kr
Ph.D. dissertation :
"A study on Highly Reliable Flex-on-Board Interconnection Using Solder Anisotropic Conductive Films(ACFs) and Ultrasonic Bonding Method"


Kim, Young Lyong (M.S.)

삼성전자
Email : simrobot@kaist.ac.kr
M.S. dissertation :
"Effects of Silicon chip and Anisotropic Conductive Films(ACFs) on the Bending property of the Chip in Flex(CIF) package"


Kim, Young Soon (Ph.D.)

삼성전기
Email : ysoon@kaist.ac.kr
Ph.D. dissertation :
"Effects of Non-Conductive Film(NCF) and Substrate materials properties on the reliability of Chip-on-Board assembly"


Kim, Tae Wan (Ph.D.)

삼성전자
Email : tkim31@kaist.ac.kr
Ph.D. dissertation :
"A Study on Nanofiber/Sn58Bi Solder Anisotropic Conductive Films(ACFs) Interconnection and Bendinig Characteristics for Flex-on-Flex(FOF) Assembly"

Lee, Hyeong-Gi (Ph.D.)

삼성전자
Email : gold1426@kaist.ac.kr
Ph.D. dissertation :
"Effects of Non-Conductive Film (NCF) Resin Formulation and Bonding Parameters on High-speed Cu pillar/Sn-Ag Micro-bump Bonding"

Cho, Se Min(M.S.)

SK하이닉스
Email : semin.cho@kaist.ac.kr
M.S. dissertation :
"A Study on fabrication of the Glass Circuit Board (GCB) and its ultra-fine pitch chip assembly using Non-Conductive Films (NCFs)"

Lee, Sang-Hoon (Ph.D.)

삼성전자
Email : svl0583@kaist.ac.kr
Ph.D. dissertation :
"A Study on the Suppresion of Conductive Particle Movement in Anisotropic Conductive Films (ACFs) for Ultra
Fine Pitch Assembly"

Lee, Jung-Sik (M.S.)

삼성전자
Email : blue29sik@kaist.ac.kr
M.S. dissertation :
"A Study on the Ultra Fine Pitch Chip-on-Plastic (COP) Packaging Using Nanofiber Anisotropic Conductive Films (ACFs)

Yu, Young Hyun (M.S.)

삼성전자
Email : homme_y@kaist.ac.kr
M.S. dissertation :
"A Study on Non-Conductive Film Materials and Bonding Conditions for High-Speed Cu/Sn-Ag Hybrid-Bump Bonding"

Hong, Hye Eun (M.S.)

삼성전자
Email : hhe612@kaist.ac.kr
M.S. dissertation :
"A study on the Flex-on-Fabric (FOF) Interconnection Using Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method"

Zhang, Shuye (Ph.D.)

Harbin Institute of Technology (HIT), Associate Professor
Email :
Ph.D. dissertation :

Lee, Jisoo (M.S.)

삼성전자
Email :
M.S. dissertation :

Myeong, Se-Ho (M.S.)

LG이노텍
Email :
M.S.