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Ph.D Students  ──────────────────────────────────────────

Jung, Seung Yoon

Email : gaiusjsy@kaist.ac.kr
B.S. 2005. 03. ~ 2012. 02. Hanyang Univ. M.S.E.
M.S. 2012. 02. ~ 2014. 02. KAIST M.S.E.
Ph.D 2014. 02. ~ KAIST M.S.E.
Research Interest :

Development of Cu pattern lamination methods for Electroinc Textile fabrication



Lee, Se Yong
Email : lsy@kaist.ac.kr
B.S. 2006. 03. ~ 2012. 02. Hanyang Univ. M.S.E.
M.S. 2012. 02. ~ 2014. 02. KAIST M.S.E.
Ph.D 2014. 09. ~ KAIST M.S.E.
Research Interest :

Development of novel double layer NCFs for ultra-fine pitch TSV interconnection


Kim, Ji Hye
Email : 24jh@kaist.ac.kr
B.S. 2009. 02. ~ 2013. 02. Sejong Univ. M.S.E.
M.S. 2013. 03. ~ 2015. 02. KAIST M.S.E.
Ph.D 2015. 03. ~ KAIST M.S.E.
Research Interest :

Development of ACFs for flexible device

   

Lee, Han Min
Email : hanmin@kaist.ac.kr
B.S. 2006. 03. ~ 2010. 08. Chungnam National Univ.. M.S.E.
M.S. 2012. 09. ~ 2014. 08. GIST M.S.E.
Ph.D 2016. 03. ~ KAIST M.S.E.


Research Interest :

Development of NCFs for ultra-fine pitch Chip on Board (COB) interconnection


- Yoon, Dal Jin
Email : djyoon@kaist.ac.kr
B.S. 2008. 03. ~ 2014. 02. Sejong Univ. M.S.E.
M.S. 2014. 09. ~ 2016. 08. KAIST M.S.E.
Ph.D. 2016. 09 ~ KAIST M.S.E.


Research Interest :

Development of Anchoring Polymer Layer (APL) ACFs for ultra-fine pitch interconnection


- Pan Yan
Email : amy1004@kaist.ac.kr
B.S. 2010. 03. ~ 2015. 02. YUST Chemical Engineering
M.S. 2015. 03. ~ 2017. 02. KAIST M.S.E.
Ph.D. 2017. 03 ~ KAIST M.S.E.


Research Interest :

Chip on Flex (COF) using Ansitopic Conductive Films(ACFs)

   

- Park, Jae Hyeong
Email : jaehyeong.park@kaist.ac.kr
B.S. 2010. 09. ~ 2015. 07. Tsinghua Univ. M.S.E.
M.S-Ph.D Integrated Course : 2017.03. ~ KAIST M.S.E.

Research Interest :

Development for Flexible ultrasound package using ACFs




   

Master Students   ─────────────────────────────────────────


   

- Kim, Ji Hyun
Email :jihyun94@kaist.ac.kr
B.S. 2012.03~2016.02 Kookmin Univ., M.S.E.
M.S. 2016.09. ~ KAIST M.S.E.

Research Interest :

Flexible Chip-in-Plastic interconnections for Flexible OLEDs

   

- Byeon, Jun Ho
Email :beanjuno@kaist.ac.kr
B.S. 2010.02~2016.08 Sejong Univ., M.S.E.
M.S. 2017.03. ~ KAIST M.S.E.

Research Interest :

Dispersion of conductive particles using electric-/magnetic- field for Anchoring polymer layer (APL) ACFs

   

- Shin, Sang Myung
Email :sm.shin@kaist.ac.kr
B.S. 2010.03~2016.08 Kyungpook National Univ., M.S.E.
M.S. 2017.09. ~ KAIST M.S.E.

Research Interest :


Development of Epoxy Molding Films(EMFs) for Fan-Out-Panel-Level-Packages(FOPLPs)

   

-Song Lu
Email :melindamay9510@kaist.ac.kr
B.S. 2013.09~2017.07 Wuhan Polytechnic University, Pharmaceutical Engineering.
M.S. 2017.09. ~ KAIST M.S.E.

Research Interest :

   

- Jang, Min Gu
Email : jang3957@kaist.ac.kr
B.S. 2012.03. ~ 2018.02. Hanyang Univ. M.S.E.
M.S. 2018.03. ~ KAIST M.S.E.

Research Interest :

   

- Ko, Eun Kyoung
Email :eko1227@kaist.ac.kr
B.S. 2013.09 ~ 2018.02 KAIST M.S.E.
M.S. 2018.03. ~ KAIST M.S.E.

Research Interest :

   

-Jang, Gi Jae
Email :kijaeils@kaist.ac.kr
B.S. 2014.03 ~ 2018.02 KAIST M.S.E.
M.S. 2018.03. ~ KAIST M.S.E.

Research Interest :