Prof. Kyung W. Paik

Department of Materials Science & Engineering (신소재공학과)
Nano-Packaging & Interconnection Lab.(NPIL-나노패키징 및 접속 연구실)

Email : kwpaik@kaist.ac.kr
TEL 82-42-350-3335
HP 010-5422-4335


Nano Packaging & Interconnect Laboratory (NPIL)
Department of Materials Science and Engineering
Korea Advanced Institute of Science and Technology, Daejeon, KOREA 305-701


To carry out research, development, and prototype manufacturing in low-cost, high-performance portable electronic packages compatible with industry needs; to transfer this knowledge to industry; and to produce world-class electronic packaging engineers by educating students.


NPIL, which aims to be a national top laboratory for low-cost, high-performance electronics, features complete process capability for highly reliable interconnection method for next generation interconnection, ACF (Anisotropic Conductive Film) development, flip-chip interconnection, Nano-packaging and 3D TSV packaging. There are currently eleven graduate students

In NPIL working following areas

- Anisotroptic Conductive Film (ACF) Development and Its Flip-Chip Application
- Fast-curable and low-temperature Ultrasonic bonding using ACF
- Minor-dopant added solder for highly-reliable interconnection
- Nano-fiber ACFs and Anchoring Polymer Layer ACFs (APL-ACFs) for ultra-fine pitch Chip-on-Glass (COG)
and Chip-on-Plastic (COP) interconnection
- Nano-fiber solder-ACF for ultra-fine pitch Flex-on-Flex (FOF) interconnection
- 3D Through SIlicon Via (TSV) packaging
- Cu/Sn-Ag solder double bump interconnection using Non-Conductive Adhesive (NCF)
- Flexible Packaging Technology using ACFs : Chip-in-Flex (CIF), Flex-on-Flex (FOF), Flex-on-Fabric (FOF)