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Flip chip bonder (Fineplacer - lambdaⓒ)

Applications
Flip chip interconnection of ACF and solder
Specifications
- Bonding force : 20 ~ 200 N
- Chip contact heating, Module Max.rate : 6℃/sec
- Heating plate, Max.rate : 20℃/sec
- Max. temperature : 400℃
- Placement accracy : 1㎛

     
 

Flip chip bonder (Fineplacer - picoⓒ)

Applications
Flip chip interconnection of solder and ACF
Specifications
- Bonding force : ~ 200 N
- Mirage system
- Fine pitch flip chip interconnection

     
 

Thermocompression bonder

Applications
Flex on board and Flex on glass
Thermo-compression bonding
Specifications
- Max temperature : 399℃

     
 

Ultrasonic bonder

Applications
ACF/NCFs bonding
Specifications
- Power : 160 ~ 240W
- Bonding force : 3.5 ~ 6.5kg

     
 

COG Bonder

Applications
COG bonder

Specifications
- Automated tray
- Temperature: 0~350 C



     
 

Wire ball welding machine
shenzhen CREASTAR automatic equipment WT-2001
Applications
Au wire bonding
Specifications
- Wire diameter: 1.0mil.~0.7mil.
- Bonding force : 35 ~ 180 g/f
- Ultrasonic : 0~5 W